256Mb: 3V Embedded Parallel NOR Flash
Features
Parallel NOR Flash Embedded Memory
M29W256GH, M29W256GL
Features
• VPP/WP# pin protection
– Protects first or last block regardless of block
-protection settings
• Software protection
– Volatile protection
– Nonvolatile protection
– Password protection
• Extended memory block
– 128-word (256-byte) memory block for permanent, secure identification
– Programmed or locked at the factory or by the
customer
• Common Flash interface
– 64-bit security code
• Low power consumption: Standby and automatic
mode
• JESD47H-compliant
– 100,000 minimum PROGRAM/ERASE cycles per
block
– Data retention: 20 years (TYP)
• 65nm single-level cell (SLC) process technology
• Fortified BGA, TBGA, and TSOP packages
• "Green" packages available
– RoHS-compliant
– Halogen-free
• Automotive device grade (6) temperature:
–40°C to +85°C (automotive grade-certified)
• Automotive device grade (3) temperature:
–40°C to +125°C (automotive grade-certified)
• Supply voltage
– VCC = 2.7–3.6V (program, erase, read)
– VCCQ = 1.65–3.6V (I/O buffers)
– VPPH = 12V for fast program (optional)
• Asynchronous random/page read
– Page size: 8 words or 16 bytes
– Page access: 25ns, 30ns
– Random access: 60ns1, 70ns, 80ns
• Fast program commands: 32-word (64-byte) write
buffer
• Enhanced buffered program commands: 256-word
• Program time
– 16µs per byte/word (TYP)
– Chip program time: 10s with V PPH and 16s without V PPH
• Memory organization
– Uniform blocks: 256 main blocks, 128KB, or 64Kwords each
• Program/erase controller
– Embedded byte/word program algorithms
• Program/erase suspend and resume capability
– Read from any block during a PROGRAM SUSPEND operation
– Read or program another block during an ERASE
SUSPEND operation
• Unlock bypass, block erase, chip erase, write to buffer and program
– Fast buffered/batch programming
– Fast block/chip erase
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Note:
1
1. The 60ns device is available upon customer
request.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
256Mb: 3V Embedded Parallel NOR Flash
Features
Part Numbering Information
Available with extended memory block prelocked by Micron. Devices are shipped from the factory with memory
content bits erased to 1. For available options, such as packages or high/low protection, or for further information,
contact your Micron sales representative. Part numbers can be verified at www.micron.com. Feature and specification comparison by device type is available at www.micron.com/products. Contact the factory for devices not
found.
Table 1: Part Number Information
Part Number
Category
Device type
Category Details
Notes
M29W
Operating voltage
W = VCC = 2.7 to 3.6V
Device function
256GH = 256Mb (x8/x16) page, uniform block Flash memory, highest block protected by
VPP/WP#
256GL = 256Mb (x8/x16) page, uniform block Flash memory, lowest block protected by
VPP/WP#
Speed
Package
70 = 70ns
1
60 = 60ns
1, 2
7A = 70ns
1, 3
N = 56-pin TSOP, 14mm x 20mm, lead-free, halogen-free, RoHS-compliant
ZA = 64-ball TBGA, 10mm x 13mm, lead-free, halogen-free, RoHS-compliant
ZS = 64-ball fortified BGA, 11mm x 13mm
Temperature range
1 = 0 to 70°C
6 = –40°C to +85°C
3 = –40°C to +125°C
Shipping options
E = RoHS-compliant package, standard packing
F = RoHS-compliant package, tape and reel packing
Notes:
1. 80ns if VCCQ = 1.65V to VCC.
2. The 60ns device is available upon customer request.
3. Automotive-qualified, available only with option 6. Qualified and characterized according to AEC Q100 and
Q003 or equivalent; advanced screening according to AEC Q001 and Q002 or equivalent.
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256Mb: 3V Embedded Parallel NOR Flash
Features
Contents
Important Notes and Warnings ......................................................................................................................... 7
General Description ......................................................................................................................................... 8
Signal Assignments ........................................................................................................................................... 9
Signal Descriptions ......................................................................................................................................... 11
Memory Organization .................................................................................................................................... 12
Memory Configuration ............................................................................................................................... 12
Memory Map – 256Mb Density ................................................................................................................... 12
Bus Operations ............................................................................................................................................... 13
Read .......................................................................................................................................................... 13
Write .......................................................................................................................................................... 13
Standby and Automatic Standby ................................................................................................................. 13
Output Disable ........................................................................................................................................... 14
Reset .......................................................................................................................................................... 14
Registers ........................................................................................................................................................ 15
Status Register ............................................................................................................................................ 15
Lock Register .............................................................................................................................................. 19
Standard Command Definitions – Address/Data Cycles ................................................................................... 22
READ Operations ........................................................................................................................................... 24
READ/RESET Command ............................................................................................................................ 24
READ CFI Command .................................................................................................................................. 24
AUTO SELECT Operations .............................................................................................................................. 25
AUTO SELECT Command ........................................................................................................................... 25
Bypass Operations .......................................................................................................................................... 28
UNLOCK BYPASS Command ...................................................................................................................... 28
UNLOCK BYPASS RESET Command ............................................................................................................ 28
Program Operations ....................................................................................................................................... 29
PROGRAM Command ................................................................................................................................ 29
UNLOCK BYPASS PROGRAM Command ..................................................................................................... 29
WRITE TO BUFFER PROGRAM Command .................................................................................................. 29
UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command ....................................................................... 32
WRITE TO BUFFER PROGRAM CONFIRM Command .................................................................................. 32
BUFFERED PROGRAM ABORT AND RESET Command ................................................................................ 32
PROGRAM SUSPEND Command ................................................................................................................ 32
PROGRAM RESUME Command .................................................................................................................. 33
ENTER and EXIT ENHANCED BUFFERED PROGRAM Command ................................................................ 33
ENHANCED BUFFERED PROGRAM Command ........................................................................................... 33
ENHANCED BUFFERED PROGRAM ABORT AND RESET Command ............................................................ 36
Erase Operations ............................................................................................................................................ 37
CHIP ERASE Command .............................................................................................................................. 37
UNLOCK BYPASS CHIP ERASE Command ................................................................................................... 37
BLOCK ERASE Command ........................................................................................................................... 37
UNLOCK BYPASS BLOCK ERASE Command ................................................................................................ 38
ERASE SUSPEND Command ....................................................................................................................... 38
ERASE RESUME Command ........................................................................................................................ 39
Block Protection Command Definitions – Address/Data Cycles ........................................................................ 40
Protection Operations .................................................................................................................................... 43
LOCK REGISTER Commands ...................................................................................................................... 43
PASSWORD PROTECTION Commands ....................................................................................................... 43
NONVOLATILE PROTECTION Commands .................................................................................................. 43
NONVOLATILE PROTECTION BIT LOCK BIT Commands ............................................................................ 45
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256Mb: 3V Embedded Parallel NOR Flash
Features
VOLATILE PROTECTION Commands ..........................................................................................................
EXTENDED MEMORY BLOCK Commands ..................................................................................................
EXIT PROTECTION Command ....................................................................................................................
Device Protection ...........................................................................................................................................
Hardware Protection ..................................................................................................................................
Software Protection ....................................................................................................................................
Volatile Protection Mode .............................................................................................................................
Nonvolatile Protection Mode ......................................................................................................................
Password Protection Mode ..........................................................................................................................
Common Flash Interface ................................................................................................................................
Power-Up and Reset Characteristics ................................................................................................................
Absolute Ratings and Operating Conditions .....................................................................................................
DC Characteristics ..........................................................................................................................................
Read AC Characteristics ..................................................................................................................................
Write AC Characteristics .................................................................................................................................
Accelerated Program, Data Polling/Toggle AC Characteristics ...........................................................................
Program/Erase Characteristics ........................................................................................................................
Package Dimensions .......................................................................................................................................
Revision History .............................................................................................................................................
Rev. F – 2/18 ...............................................................................................................................................
Rev. E – 7/16 ...............................................................................................................................................
Rev. D – 5/15 ..............................................................................................................................................
Rev. C – 7/13 ...............................................................................................................................................
Rev. B – 5/13 ...............................................................................................................................................
Rev. A – 5/12 ...............................................................................................................................................
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45
45
46
47
47
47
48
48
49
50
54
57
59
61
64
71
73
74
77
77
77
77
77
77
77
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256Mb: 3V Embedded Parallel NOR Flash
Features
List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 8
Figure 2: 56-Pin TSOP (Top View) .................................................................................................................... 9
Figure 3: 64-Ball Fortified BGA and 64-Ball TBGA ........................................................................................... 10
Figure 4: Data Polling Flowchart .................................................................................................................... 17
Figure 5: Toggle Bit Flowchart ........................................................................................................................ 18
Figure 6: Status Register Polling Flowchart ..................................................................................................... 19
Figure 7: Lock Register Program Flowchart ..................................................................................................... 21
Figure 8: WRITE TO BUFFER PROGRAM Flowchart ........................................................................................ 31
Figure 9: ENHANCED BUFFERED PROGRAM Flowchart ................................................................................ 35
Figure 10: Program/Erase Nonvolatile Protection Bit Algorithm ...................................................................... 44
Figure 11: Software Protection Scheme .......................................................................................................... 49
Figure 12: Power-Up Timing .......................................................................................................................... 54
Figure 13: Reset AC Timing – No PROGRAM/ERASE Operation in Progress ...................................................... 55
Figure 14: Reset AC Timing During PROGRAM/ERASE Operation .................................................................... 56
Figure 15: AC Measurement Load Circuit ....................................................................................................... 58
Figure 16: AC Measurement I/O Waveform ..................................................................................................... 58
Figure 17: Random Read AC Timing (8-Bit Mode) ........................................................................................... 62
Figure 18: Random Read AC Timing (16-Bit Mode) ......................................................................................... 62
Figure 19: Page Read AC Timing (16-Bit Mode) ............................................................................................... 63
Figure 20: WE#-Controlled Program AC Timing (8-Bit Mode) .......................................................................... 65
Figure 21: WE#-Controlled Program AC Timing (16-Bit Mode) ......................................................................... 66
Figure 22: CE#-Controlled Program AC Timing (8-Bit Mode) ........................................................................... 68
Figure 23: CE#-Controlled Program AC Timing (16-Bit Mode) ......................................................................... 69
Figure 24: Chip/Block Erase AC Timing (8-Bit Mode) ...................................................................................... 70
Figure 25: Accelerated Program AC Timing ..................................................................................................... 71
Figure 26: Data Polling AC Timing .................................................................................................................. 72
Figure 27: Toggle/Alternative Toggle Bit Polling AC Timing (8-Bit Mode) .......................................................... 72
Figure 28: 56-Pin TSOP – 14mm x 20mm ........................................................................................................ 74
Figure 29: 64-Ball TBGA – 10mm x 13mm ....................................................................................................... 75
Figure 30: 64-Ball Fortified BGA – 11mm x 13mm ........................................................................................... 76
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256Mb: 3V Embedded Parallel NOR Flash
Features
List of Tables
Table 1: Part Number Information ................................................................................................................... 2
Table 2: Signal Descriptions ........................................................................................................................... 11
Table 3: 256Mb, Blocks[255:0] ........................................................................................................................ 12
Table 4: Bus Operations ................................................................................................................................. 13
Table 5: Status Register Bit Definitions ........................................................................................................... 15
Table 6: Operations and Corresponding Bit Settings ........................................................................................ 16
Table 7: Lock Register Bit Definitions ............................................................................................................. 20
Table 8: Block Protection Status ..................................................................................................................... 20
Table 9: Standard Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit ............................................ 22
Table 10: Read Electronic Signature ............................................................................................................... 25
Table 11: Block Protection ............................................................................................................................. 27
Table 12: Block Protection Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit ............................... 40
Table 13: Extended Memory Block Address and Data ...................................................................................... 45
Table 14: V PP/WP# Functions ......................................................................................................................... 47
Table 15: Query Structure Overview ............................................................................................................... 50
Table 16: CFI Query Identification String ........................................................................................................ 50
Table 17: CFI Query System Interface Information .......................................................................................... 51
Table 18: Device Geometry Definition ............................................................................................................ 51
Table 19: Primary Algorithm-Specific Extended Query Table ........................................................................... 52
Table 20: Security Code Area .......................................................................................................................... 53
Table 21: Power-Up Wait Timing Specifications .............................................................................................. 54
Table 22: Reset AC Specifications ................................................................................................................... 55
Table 23: Absolute Maximum/Minimum Ratings ............................................................................................ 57
Table 24: Operating Conditions ...................................................................................................................... 57
Table 25: I/O Capacitance1 ............................................................................................................................ 58
Table 26: DC Current Characteristics .............................................................................................................. 59
Table 27: DC Voltage Characteristics .............................................................................................................. 60
Table 28: Read AC Characteristics .................................................................................................................. 61
Table 29: WE#-Controlled Write AC Characteristics ......................................................................................... 64
Table 30: CE#-Controlled Write AC Characteristics ......................................................................................... 67
Table 31: Accelerated Program and Data Polling/Data Toggle AC Characteristics .............................................. 71
Table 32: Program/Erase Characteristics ........................................................................................................ 73
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256Mb: 3V Embedded Parallel NOR Flash
Important Notes and Warnings
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this document if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
Automotive Applications. Products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of nonautomotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in which failure of the Micron component could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environmental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or environmental damages will result from failure of any semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.
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256Mb: 3V Embedded Parallel NOR Flash
General Description
General Description
The M29W is an asynchronous, uniform block, parallel NOR Flash memory device manufactured on 65nm single-level cell (SLC) technology. READ, ERASE, and PROGRAM operations are performed using a single low-voltage supply. Upon power-up, the device
defaults to read array mode.
The main memory array is divided into uniform blocks that can be erased independently so that valid data can be preserved while old data is purged. PROGRAM and ERASE
commands are written to the command interface of the memory. An on-chip program/
erase controller simplifies the process of programming or erasing the memory by taking
care of all special operations required to update the memory contents. The end of a
PROGRAM or ERASE operation can be detected, and any error condition can be identified. The command set required to control the device is consistent with JEDEC standards.
CE#, OE#, and WE# control the bus operation of the device and enable a simple connection to most microprocessors, often without additional logic.
The M29W supports asynchronous random read and page read from all blocks of the
array. It features a write to buffer program capability that improves throughput by programming a buffer of 32 words in one command sequence. Also, in x16 mode, the enhanced buffered program capability improves throughput by programming 256 words
in one command sequence. The device V PP/WP# signal enables faster programming.
The device contains a 128-word (x16) and 256-byte (x8) extended memory block. The
user can program this additional space and then protect it to permanently secure the
contents. The device also features different levels of hardware and software protection
to secure blocks from unwanted modification.
Figure 1: Logic Diagram
VCC
VCCQ
VPP/WP#
15
A[23:0]
DQ[14:0]
DQ15/A-1
WE#
CE#
OE#
RY/BY#
RST#
BYTE#
VSS
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256Mb: 3V Embedded Parallel NOR Flash
Signal Assignments
Signal Assignments
Figure 2: 56-Pin TSOP (Top View)
A23
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RST#
A21
VPP/WP#
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
RFU
RFU
Notes:
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55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
RFU
RFU
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
RFU
VCCQ
1. A23 = A[MAX].
2. A-1 is the least significant address bit in x8 mode.
9
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256Mb: 3V Embedded Parallel NOR Flash
Signal Assignments
Figure 3: 64-Ball Fortified BGA and 64-Ball TBGA
1
2
RFU
A3
3
4
5
6
7
8
8
7
6
A9
A13
RFU
RFU
A13
A9
5
4
3
2
1
A3
RFU
A
A
A7 RY/BY# WE#
WE# RY/BY# A7
B
B
RFU
A4
A17 VPP/WP# RST#
A8
A12
A22
A22
A12
A8
RST# VPP/WP# A17
A4
RFU
RFU
A2
A6
A18
A10
A14
A23
A23
A14
A10
A21
A2
RFU
C
C
A21
A18
A6
D
D
RFU
A1
A5
A20
A19
A11
A15
VCCQ
VCCQ
A15
A11
A19
A20
A5
A1
RFU
RFU
A0
D0
D2
D5
D7
A16
VSS
VSS
A16
D7
D5
D2
D0
A0
RFU
E
E
F
F
VCCQ
CE#
D8
D10
D12
D14 BYTE# RFU
RFU BYTE# D14
D12
D10
D8
CE#
VCCQ
RFU
OE#
D9
D11
VCC
D13 D15/A-1 RFU
RFU D15/A-1 D13
VCC
D11
D9
OE#
RFU
G
G
H
H
RFU
VSS
D1
D3
D4
D6
VSS
RFU
RFU
Top view – ball side down
Notes:
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VSS
D6
D4
D3
D1
VSS
RFU
Bottom view – ball side up
1. A[23] = A[MAX].
2. A-1 is the least significant address bit in x8 mode.
10
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256Mb: 3V Embedded Parallel NOR Flash
Signal Descriptions
Signal Descriptions
The signal description table below is a comprehensive list of signals for this device family. All signals listed may not be supported on this device. See Signal Assignments for information specific to this device.
Table 2: Signal Descriptions
Name
Type
Description
A[MAX:0]
Input
Address: Selects the cells in the array to access during READ operations. During WRITE operations, they control the commands sent to the command interface of the program/erase controller.
CE#
Input
Chip enable: Activates the device, enabling READ and WRITE operations to be performed.
When CE# is HIGH, the device goes to standby, and data outputs are at High-Z.
OE#
Input
Output enable: Controls the bus READ operation.
WE#
Input
Write enable: Controls the bus WRITE operation of the command interface.
VPP/WP#
Input
VPP/write protect: Provides WRITE PROTECT function and VPPH function. These functions
protect the lowest or highest block and enable the device to enter unlock bypass mode, respectively. (Refer to Hardware Protection and Bypass Operations for details.)
BYTE#
Input
Byte/word organization select: Switches between x8 and x16 bus modes. When BYTE# is
LOW, the device is in x8 mode; when HIGH, the device is in x16 mode.
RST#
Input
Reset: Applies a hardware reset to the device, which is achieved by holding RST# LOW for at
least tPLPX. After RST# goes HIGH, the device is ready for READ and WRITE operations (after
tPHEL or tRHEL, whichever occurs last). (See RESET AC Specifications for more details.)
DQ[7:0]
I/O
Data I/O: Outputs the data stored at the selected address during a READ operation. During
WRITE operations, they represent the commands sent to the command interface of the internal state machine.
DQ[14:8]
I/O
Data I/O: Outputs the data stored at the selected address during a READ operation when
BYTE# is HIGH. When BYTE# is LOW, these pins are not used and are High-Z. During WRITE
operations, these bits are not used. When reading the status register, these bits should be ignored.
DQ15/A-1
I/O
Data I/O or address input: When the device operates in x16 bus mode, this pin behaves as
data I/O, together with DQ[14:8]. When the device operates in x8 bus mode, this pin behaves
as the least significant bit of the address.
Except where stated explicitly otherwise, DQ15 = data I/O (x16 mode); A-1 = address input (x8
mode).
RY/BY#
Output
Ready/busy: Open-drain output that can be used to identify when the device is performing
a PROGRAM or ERASE operation. During PROGRAM or ERASE operations, RY/BY# is LOW,
and is High-Z during read mode, auto select mode, and erase suspend mode. After a hardware reset, READ and WRITE operations cannot begin until RY/BY# goes High-Z. (See RESET
AC Specifications for more details.)
The use of an open-drain output enables the RY/BY# pins from several devices to be connected to a single pull-up resistor to VCCQ. A low value will then indicate that one (or more) of
the devices is (are) busy. A 10,000Ω or higher resistor is recommended as pull-up resistor to
achieve 0.1V VOL.
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256Mb: 3V Embedded Parallel NOR Flash
Memory Organization
Table 2: Signal Descriptions (Continued)
Name
Type
VCC
Supply
Description
Supply voltage: Provides the power supply for READ, PROGRAM, and ERASE operations.
The command interface is disabled when VCC ≤ VLKO. This prevents WRITE operations from accidentally damaging the data during power-up, power-down, and power surges. If the program/erase controller is programming or erasing during this time, then the operation aborts,
and the contents being altered will be invalid.
A 0.1μF capacitor should be connected between VCC and VSS to decouple the current surges
from the power supply. The PCB track widths must be sufficient to carry the currents required
during PROGRAM and ERASE operations. (See DC Characteristics.)
VCCQ
Supply
I/O supply voltage: Provides the power supply to the I/O pins and enables all outputs to be
powered independently from VCC.
VSS
Supply
Ground: All VSS pins must be connected to the system ground.
RFU
–
Reserved for future use: RFUs should be not connected.
Memory Organization
Memory Configuration
The main memory array is divided into 128KB or 64KW uniform blocks.
Memory Map – 256Mb Density
Table 3: 256Mb, Blocks[255:0]
Address Range (x8)
Block
Block
Size
Start
255
128KB
1FE 0000h
Address Range (x16)
End
Block
Size
Start
End
1FF FFFFh
64KW
0FF 0000h
0FF FFFFh
⋮
⋮
⋮
⋮
⋮
127
0FE 0000h
0FF FFFFh
07F 0000h
07F FFFFh
⋮
⋮
⋮
⋮
⋮
63
07E 0000h
07F FFFFh
03F 0000h
03F FFFFh
⋮
⋮
⋮
⋮
⋮
0
000 0000h
001 FFFFh
000 0000h
000 FFFFh
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256Mb: 3V Embedded Parallel NOR Flash
Bus Operations
Bus Operations
Table 4: Bus Operations
Notes 1 and 2 apply to entire table
8-Bit Mode
Operation
READ
CE# OE# WE# RST# VPP/WP#
L
L
H
16-Bit Mode
A[MAX:0],
DQ15/A-1
DQ[14:8]
DQ[7:0]
A[MAX:0]
DQ15/A-1,
DQ[14:0]
Cell address
High-Z
Data output
Cell address
Data output
input4
Command
address
Data input4
H
X
Command
address
High-Z
WRITE
L
H
L
H
X3
STANDBY
H
X
X
H
X
X
High-Z
High-Z
X
High-Z
OUTPUT
DISABLE
L
H
H
H
X
X
High-Z
High-Z
X
High-Z
RESET
X
X
X
L
X
X
High-Z
High-Z
X
High-Z
Notes:
Data
1. Typical glitches of less than 5ns on CE#, WE#, and RST# are ignored by the device and do
not affect bus operations.
2. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
3. If WP# is LOW, then the highest or the lowest block remains protected, depending on
line item.
4. Data input is required when issuing a command sequence or when performing data
polling or block protection.
Read
Bus READ operations read from the memory cells, registers, or CFI space. To accelerate
the READ operation, the memory array can be read in page mode where data is internally read and stored in a page buffer.
The page size is 8 words (16 bytes) and is addressed by address inputs A[2:0] in x16 bus
mode and A[2:0] plus DQ15/A-1 in x8 bus mode. The extended memory blocks and CFI
area do not support page read mode.
A valid READ operation requires setting the appropriate address on the address inputs,
taking CE# and OE# LOW, and holding WE# HIGH. Data I/O signals output the value.
Write
Bus WRITE operations write to the command interface. A valid WRITE operation requires setting the appropriate address on the address inputs. These are latched by the
command interface on the falling edge of CE# or WE#, whichever occurs last. Values on
data I/O signals are latched by the command interface on the rising edge of CE# or
WE#, whichever occurs first. OE# must remain HIGH during the entire operation.
Standby and Automatic Standby
When the device is in read mode, driving CE# HIGH places the device in standby mode
and drives data I/Os to High-Z. Supply current is reduced to standby (ICC2) by holding
CE# within V CC ±0.3V.
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256Mb: 3V Embedded Parallel NOR Flash
Bus Operations
During PROGRAM or ERASE operations, the device continues to use the program/erase
supply current (ICC3) until the operation completes.
Automatic standby enables low power consumption during read mode. When CMOS
levels (VCC ± 0.3 V) drive the bus, and following a READ operation and a period of inactivity specified in DC Characteristics, the memory enters automatic standby as internal
supply current is reduced to ICC2. Data I/O signals still output data if a READ operation
is in progress. Depending on load circuits connected with data bus, V CCQ can have a
null consumption when the memory enters automatic standby.
Output Disable
Data I/Os are High-Z when OE# is HIGH.
Reset
During reset mode, the device is deselected, and outputs are High-Z. The device is in
reset mode when RST# is LOW. Power consumption is reduced to standby level independently from CE#, OE#, or WE# inputs.
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256Mb: 3V Embedded Parallel NOR Flash
Registers
Registers
Status Register
Table 5: Status Register Bit Definitions
Note 1 applies to entire table
Bit
Name
Settings
Description
Notes
DQ7
Data polling 0 or 1, depending on
bit
operations
Monitors whether the program/erase controller has successfully completed its operation, or has responded to an ERASE SUSPEND operation.
2, 3, 4
DQ6
Toggle bit
Toggles: 0 to 1; 1 to 0;
and so on
Monitors whether the program/erase controller has successfully completed its operations, or has responded to an ERASE
SUSPEND operation. During a PROGRAM/ERASE operation,
DQ6 toggles from 0 to 1, 1 to 0, and so on, with each successive READ operation from any address.
3, 4, 5
DQ5
Error bit
0 = Success
1 = Failure
Identifies errors detected by the program/erase controller. DQ5
is set to 1 when a PROGRAM, BLOCK ERASE, or CHIP ERASE operation fails to write the correct data to the memory.
4, 6
DQ3
Erase timer
bit
0 = Erase not in progress
1 = Erase in progress
Identifies the start of program/erase controller operation during a BLOCK ERASE command. Before the program/erase controller starts, this bit set to 0, and additional blocks to be
erased can be written to the command interface.
4
DQ2
Alternative
toggle bit
Toggles: 0 to 1; 1 to 0;
and so on
Monitors the program/erase controller during ERASE operations. During CHIP ERASE, BLOCK ERASE, and ERASE SUSPEND
operations, DQ2 toggles from 0 to 1, 1 to 0, and so on, with
each successive READ operation from addresses within the
blocks being erased.
3, 4
DQ1
Buffered
program
abort bit
1 = Abort
Indicates a BUFFER PROGRAM operation abort. The BUFFERED
PROGRAM ABORT and RESET command must be issued to return the device to read mode (see WRITE TO BUFFER PROGRAM command).
Notes:
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1. The status register can be read during PROGRAM, ERASE, or ERASE SUSPEND operations;
the READ operation outputs data on DQ[7:0].
2. For a PROGRAM operation in progress, DQ7 outputs the complement of the bit being
programmed. For a READ operation from the address previously programmed successfully, DQ7 outputs existing DQ7 data. For a READ operation from addresses with blocks
to be erased while an ERASE SUSPEND operation is in progress, DQ7 outputs 0; upon
successful completion of the ERASE SUSPEND operation, DQ7 outputs 1. For an ERASE
operation in progress, DQ7 outputs 0; upon either operation's successful completion,
DQ7 outputs 1.
3. After successful completion of a PROGRAM or ERASE operation, the device returns to
read mode.
4. During erase suspend mode, READ operations to addresses within blocks not being
erased output memory array data as if in read mode. A protected block is treated the
same as a block not being erased. See the Toggle Flowchart for more information.
5. During erase suspend mode, DQ6 toggles when addressing a cell within a block being
erased. The toggling stops when the program/erase controller has suspended the ERASE
operation. See the Toggle Flowchart for more information.
15
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256Mb: 3V Embedded Parallel NOR Flash
Registers
6. When DQ5 is set to 1, a READ/RESET command must be issued before any subsequent
command.
Table 6: Operations and Corresponding Bit Settings
Note 1 applies to entire table
Operation
Address
DQ7
DQ6
DQ5
DQ3
DQ2
DQ1
RY/BY#
Notes
PROGRAM
Any address
DQ7#
Toggle
0
–
No toggle
0
0
2
PROGRAM during
ERASE SUSPEND
Any address
DQ7#
Toggle
0
–
–
–
0
ENHANCED
BUFFERED
PROGRAM
Any address
–
Toggle
0
–
–
–
0
BUFFERED
PROGRAM ABORT
Any address
DQ7#
Toggle
0
–
–
1
0
PROGRAM error
Any address
DQ7#
Toggle
1
–
–
–
High-Z
CHIP ERASE
Any address
0
Toggle
0
1
Toggle
–
0
BLOCK ERASE
before time-out
Erasing block
0
Toggle
0
0
Toggle
–
0
Non-erasing block
0
Toggle
0
0
No toggle
–
0
BLOCK ERASE
ERASE SUSPEND
Erasing block
0
Toggle
0
1
Toggle
–
0
Non-erasing block
0
Toggle
0
1
No toggle
–
0
Erasing block
1
No toggle
0
–
Toggle
–
High-Z
Outputs memory array data as if in read mode
–
High-Z
Good block
address
0
Toggle
1
1
No toggle
–
High-Z
Faulty block
address
0
Toggle
1
1
Toggle
–
High-Z
Non-erasing block
BLOCK ERASE
error
Notes:
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2
1. Unspecified data bits should be ignored.
2. DQ7# for buffer program is related to the last address location loaded.
16
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256Mb: 3V Embedded Parallel NOR Flash
Registers
Figure 4: Data Polling Flowchart
Start
Read DQ7, DQ5, and DQ1
at valid address1
Yes
DQ7 = Data
No
No
DQ1 = 1
No
DQ5 = 1
Yes
Yes
Read DQ7 at valid address
DQ7 = Data
Yes
No
Failure2
Notes:
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Success
1. Valid address is the address being programmed or an address within the block being
erased.
2. Failure results: DQ5 = 1 indicates an operation error; DQ1 = 1 indicates a WRITE TO BUFFER PROGRAM ABORT operation.
17
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256Mb: 3V Embedded Parallel NOR Flash
Registers
Figure 5: Toggle Bit Flowchart
Start
Read DQ6 at valid address
Read DQ6, DQ5, and DQ1
at valid address
DQ6 = Toggle
Yes
No
DQ1 = 1
No
No
DQ5 = 1
Yes
Yes
Read DQ6 (twice) at valid address
DQ6 = Toggle
No
Yes
Failure1
Note:
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Success
1. Failure results: DQ5 = 1 indicates an operation error; DQ1 = 1 indicates a WRITE TO BUFFER PROGRAM ABORT operation.
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256Mb: 3V Embedded Parallel NOR Flash
Registers
Figure 6: Status Register Polling Flowchart
Start
Read 1
DQ7 = Valid data
Yes
Read 2
Read 3
PROGRAM operation
Yes
Read 3 correct data?
Yes
No
No
No
DQ5 = 1
Yes
PROGRAM operation
failure
Read 2
No
DQ6 = Toggling
Yes
Read2.DQ6 = Read3.DQ6
Read 3
Device error
No
DQ6 = Toggling
Yes
Read1.DQ6 = Read2.DQ6
DQ2 = Toggling
Timeout failure
Read2.DQ2 = Read3.DQ2
No
No
Yes
DQ1 = 1
Erase/suspend mode
No
ERASE operation
complete
Device busy: Repolling
WRITE TO BUFFER
PROGRAM
Yes
Yes
PROGRAM operation
complete
WRITE TO BUFFER
PROGRAM
abort
No
Device busy: Repolling
Lock Register
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256Mb: 3V Embedded Parallel NOR Flash
Registers
Table 7: Lock Register Bit Definitions
Note 1 applies to entire table
Bit Name
Settings
Description
Notes
DQ2 Password
0 = Password protection
protection
mode enabled
mode lock bit 1 = Password protection
mode disabled (Default)
Places the device permanently in password protection mode.
2
DQ1 Nonvolatile
0 = Nonvolatile protection
protection
mode enabled with passmode lock bit word protection mode
permanently disabled
1 = Nonvolatile protection
mode enabled (Default)
Places the device in nonvolatile protection mode with password protection mode permanently disabled. When shipped
from the factory, the device will operate in nonvolatile protection mode, and the memory blocks are unprotected.
2
DQ0 Extended
0 = Protected
memory
1 = Unprotected (Default)
block
protection bit
If the device is shipped with the extended memory block unlocked, the block can be protected by setting this bit to 0. The
extended memory block protection status can be read in auto
select mode by issuing an AUTO SELECT command.
Notes:
1. The lock register is a 16-bit, one-time programmable register. DQ[15:3] are reserved and
are set to a default value of 1.
2. The password protection mode lock bit and nonvolatile protection mode lock bit cannot
both be programmed to 0. Any attempt to program one while the other is programmed
causes the operation to abort, and the device returns to read mode. The device is shipped from the factory with the default setting.
Table 8: Block Protection Status
Nonvolatile
Nonvolatile
Volatile
Protection Bit Protection Protection
Lock Bit1
Bit2
Bit3
Block
Protection
Status
Block Protection Status
1
1
1
00h
Block unprotected; nonvolatile protection bit changeable.
1
1
0
01h
Block protected by volatile protection bit; nonvolatile protection bit changeable.
1
0
1
01h
Block protected by nonvolatile protection bit; nonvolatile
protection bit changeable.
1
0
0
01h
Block protected by nonvolatile protection bit and volatile
protection bit; nonvolatile protection bit changeable.
0
1
1
00h
Block unprotected; nonvolatile protection bit unchangeable.
0
1
0
01h
Block protected by volatile protection bit; nonvolatile protection bit unchangeable.
0
0
1
01h
Block protected by nonvolatile protection bit; nonvolatile
protection bit unchangeable.
0
0
0
01h
Block protected by nonvolatile protection bit and volatile
protection bit; nonvolatile protection bit unchangeable.
Notes:
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1. Nonvolatile protection bit lock bit: when cleared to 1, all nonvolatile protection bits are
unlocked; when set to 0, all nonvolatile protection bits are locked.
20
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256Mb: 3V Embedded Parallel NOR Flash
Registers
2. Block nonvolatile protection bit: when cleared to 1, the block is unprotected; when set
to 0, the block is protected.
3. Block volatile protection bit: when cleared to 1, the block is unprotected; when set to 0,
the block is protected.
Figure 7: Lock Register Program Flowchart
Start
Enter LOCK REGISTER command set
Address/data (unlock) cycle 1
Address/data (unlock) cycle 2
Address/data cycle 3
PROGRAM LOCK REGISTER
Address/data cycle 1
Address/data cycle 2
Polling algorithm
Yes
Done?
No
DQ5 = 1
No
Yes
Success:
EXIT PROTECTION command set
(Returns to device read mode)
Address/data cycle 1
Address/data cycle 2
Notes:
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Failure:
READ/RESET
(Returns device to read mode)
1. Each lock register bit can be programmed only once.
2. See the Block Protection Command Definitions table for address/data cycle details.
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256Mb: 3V Embedded Parallel NOR Flash
Standard Command Definitions – Address/Data Cycles
Standard Command Definitions – Address/Data Cycles
Table 9: Standard Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit
Note 1 applies to entire table
Address and Data Cycles
Command and
Code/Subcode
Bus
Size
1st
A
2nd
D
3rd
4th
A
D
A
D
555
55
X
F0
2AA
55
X
F0
555
55
AAA
90
A
5th
D
A
6th
D
A
D
Notes
READ and AUTO SELECT Operations
READ/RESET (F0h)
x8
x16
READ CFI (98h)
AUTO SELECT (90h)
x8
X
F0
AAA
AA
X
F0
555
AA
AA
98
x16
55
x8
AAA
x16
555
AA
2AA
Note Note
2
2
555
2, 3, 4
BYPASS Operations
UNLOCK BYPASS (20h)
UNLOCK BYPASS
RESET (90h/00h)
x8
AAA
x16
555
AA
555
55
x8
X
90
X
00
x8
AAA
AA
555
55
x16
555
x8
X
A0
PA
PD
x8
AAA
AA
555
55
BAd
25
x16
555
x8
BAd
25
BAd
N
PA
PD
BAd
29
x8
AAA
AA
555
55
AAA
F0
x16
555
2AA
AAA
20
555
x16
PROGRAM Operations
PROGRAM (A0h)
UNLOCK BYPASS
PROGRAM (A0h)
WRITE TO BUFFER
PROGRAM (25h)
x16
WRITE TO BUFFER
PROGRAM CONFIRM
(29h)
x16
x8
ENTER ENHANCED
BUFFERED
PROGRAM (38h)
x16
ENHANCED
BUFFERED
PROGRAM (33h)
x16
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A0
PA
PD
555
5
x16
UNLOCK BYPASS
WRITE TO BUFFER
PROGRAM (25h)
BUFFERED PROGRAM
ABORT and RESET (F0h)
2AA
AAA
BAd
N
PA
PD
6, 7, 8
2AA
2AA
5
555
x8
NA
555
AA
2AA
55
555
38
BAd
33
BAd
(00)
Data
BAd
(01)
Data
x8
NA
22
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256Mb: 3V Embedded Parallel NOR Flash
Standard Command Definitions – Address/Data Cycles
Table 9: Standard Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit (Continued)
Note 1 applies to entire table
Address and Data Cycles
Command and
Code/Subcode
Bus
Size
EXIT ENHANCED
BUFFERED
PROGRAM (90h)
1st
2nd
3rd
A
D
A
D
X
90
X
00
A
4th
D
x8
x16
ENHANCED
BUFFERED
PROGRAM ABORT (F0h)
555
AA
x8
X
B0
X
30
x8
AAA
AA
x16
555
x8
X
80
X
10
AA
555
55
PROGRAM RESUME
(30h)
x16
x8
A
D
A
D
A
D
AAA
AA
555
55
AAA
10
Notes
NA
x16
x16
6th
NA
x8
PROGRAM SUSPEND
(B0h)
5th
2AA
55
555
F0
555
55
AAA
80
ERASE Operations
CHIP ERASE (80/10h)
2AA
UNLOCK BYPASS
CHIP ERASE (80/10h)
x16
BLOCK ERASE (80/30h)
x8
AAA
x16
555
x8
X
80
X
B0
X
30
UNLOCK BYPASS
BLOCK ERASE (80/30h)
x16
ERASE SUSPEND (B0h)
x8
555
2AA
BAd
555
2AA
555
5
AAA
555
30
80
AAA
555
AA
555
55
BAd
30
10
2AA
5
x16
ERASE RESUME (30h)
x8
x16
Notes:
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1. A = Address; D = Data; X = "Don't Care"; BAd = Any address in the block; N = Number of
bytes to be programmed; PA = Program address; PD = Program data; Gray shading = Not
applicable. All values in the table are hexadecimal. Some commands require both a command code and subcode.
2. These cells represent READ cycles (versus WRITE cycles for the others).
3. AUTO SELECT enables the device to read the manufacturer code, device code, block protection status, and extended memory block protection indicator.
4. AUTO SELECT addresses and data are specified in the Electronic Signature table and the
Extended Memory Block Protection table.
5. For any UNLOCK BYPASS ERASE/PROGRAM command, the first two UNLOCK cycles are
unnecessary.
6. BAd must be the same as the address loaded during the WRITE TO BUFFER PROGRAM
third and fourth cycles.
7. WRITE TO BUFFER PROGRAM operation: maximum cycles = 68 (x8) and 36 (x16). UNLOCK BYPASS WRITE TO BUFFER PROGRAM operation: maximum cycles = 66 (x8) and 34
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256Mb: 3V Embedded Parallel NOR Flash
READ Operations
(x16). WRITE TO BUFFER PROGRAM operation: N + 1 = bytes to be programmed; maximum buffer size = 64 bytes (x8) and 32 words (x16).
8. For x8, A[MAX:5] address pins should remain unchanged while A[4:0] and A-1 pins are
used to select a byte within the N + 1 byte page. For x16, A[MAX:5] address pins should
remain unchanged while A[4:0] pins are used to select a word within the N + 1 word
page.
9. The following is content for address/data cycles 256 through 258: BAd (FE) - Data; BAd
(FF) - Data; BAd (00) - 29.
10. BLOCK ERASE address cycles can extend beyond six address/data cycles, depending on
the number of blocks to erase.
READ Operations
READ/RESET Command
The READ/RESET (F0h) command returns the device to read mode and resets the errors
in the status register. One or three bus WRITE operations can be used to issue the
READ/RESET command.
To return the device to read mode, this command can be issued between bus WRITE
cycles before the start of a PROGRAM or ERASE operation. If the READ/RESET command is issued during the timeout of a BLOCK ERASE operation, the device requires up
to 10μs to abort, during which time no valid data can be read.
READ CFI Command
The READ CFI (98h) command puts the device in read CFI mode and is valid only when
the device is in read array or auto select mode. One bus WRITE cycle is required to issue
the command.
Once in read CFI mode, bus READ operations will output data from the CFI memory
area. A READ/RESET command must be issued to return the device to the previous
mode (read array or auto select ). A second READ/RESET command is required to put
the device in read array mode from auto select mode.
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256Mb: 3V Embedded Parallel NOR Flash
AUTO SELECT Operations
AUTO SELECT Operations
AUTO SELECT Command
At power-up or after a hardware reset, the device is in read mode. It can then be put in
auto select mode by issuing an AUTO SELECT (90h) command or by applying V ID to A9.
Auto select mode enables the following device information to be read:
• Electronic signature, which includes manufacturer and device code information, as
shown in the Electronic Signature table.
• Block protection, which includes the block protection status and extended memory
block protection indicator, as shown in the Block Protection table.
Electronic signature or block protection information is read by executing a READ operation with control signals and addresses set, as shown in the Read Electronic Signature
table or the Block Protection table, respectively.
Auto select mode can be used by the programming equipment to automatically match a
device with the application code to be programmed.
Three consecutive bus WRITE operations are required to issue an AUTO SELECT command. The device remains in auto select mode until a READ/RESET or READ CFI command is issued.
The device cannot enter auto select mode when a PROGRAM or ERASE operation is in
progress (RY/BY# LOW). However, auto select mode can be entered if the PROGRAM or
ERASE operation has been suspended by issuing a PROGRAM SUSPEND or ERASE SUSPEND command.
To enter auto select mode by appling V ID to A9, see the Read Electronic Signature table
and the Block Protection table.
Auto select mode is exited by performing a reset. The device returns to read mode unless it entered auto select mode after an ERASE SUSPEND or PROGRAM SUSPEND
command, in which case it returns to erase or program suspend mode.
Table 10: Read Electronic Signature
Note 1 applies to entire table
READ Cycle
Manufacturer
Code
Device Code 1
Device Code 2
Device Code 3
CE#
L
L
L
L
OE#
L
L
L
L
WE#
H
H
H
H
X
X
X
X
A9
VID
VID
VID
VID
A8
X
X
X
X
Signal
Notes
Address Input, 8-Bit and 16-Bit
A[MAX:10]
A[7:5]
L
L
L
L
A4
X
X
X
X
A[3:1]
L
L
H
H
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25
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256Mb: 3V Embedded Parallel NOR Flash
AUTO SELECT Operations
Table 10: Read Electronic Signature (Continued)
Note 1 applies to entire table
READ Cycle
Manufacturer
Code
Device Code 1
Device Code 2
Device Code 3
L
H
L
H
X
X
X
X
DQ[14:8]
X
X
X
X
DQ[7:0]
20h
7Eh
22h
01h
0020h
227Eh
2222h
2201h
Signal
A0
Notes
Address Input, 8-Bit Only
DQ[15]/A-1
Data I/O, 8-Bit Only
Data I/O, 16-Bit Only
DQ[15]/A-1, and DQ[14:0]
Notes:
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1. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
2. When using the AUTO SELECT command to enter auto select mode, applying VID to A9 is
not required. A9 can be either VIL or VIH.
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AUTO SELECT Operations
Table 11: Block Protection
Note 1 applies to entire table
READ Cycle
Extended Memory
Block
Verify Indicator (GL)
Extended Memory
Block
Verify Indicator (GH)
Block Protection
Status Indicator
CE#
L
L
L
OE#
L
L
L
WE#
H
H
H
A[MAX:16]
X
X
Block base address
A[15:10]
X
X
X
A9
VID
VID
VID
A8
X
X
X
A[7:5]
L
L
L
A4
X
X
X
A[3:2]
L
L
L
A1
H
H
H
A0
H
H
L
X
X
X
DQ[14:8]
X
X
X
DQ[7:0]
89h
99h
01h
3, 5
09h
19h
00h
4, 6
0089h
0099h
0001h
3, 5
0009h
0019h
0000h
4, 6
Signal
Notes
Address Input, 8-Bit and 16-Bit
2
Address Input, 8-Bit Only
DQ[15]/A-1
Data I/O, 8-Bit Only
Data I/O, 16-Bit Only
DQ[15]/A-1, and DQ[14:0]
Notes:
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1. Read cycle output to DQ7 = Extended memory block protection indicator; GH = High
block protection; GL = Low block protection; BPS = Block protection status; H = Logic
level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
2. When using the AUTO SELECT command to enter auto select mode, applying VID to A9 is
not required. A9 can be either VIL or VIH.
3. Extended memory blocks are Micron-prelocked (permanent).
4. Extended memory blocks are customer-lockable.
5. Block protection status = protected: 01h (in x8 mode) is output on DQ[7:0].
6. Block protection status = unprotected: 00h (in x8 mode) is output on DQ[7:0].
27
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Bypass Operations
Bypass Operations
UNLOCK BYPASS Command
The UNLOCK BYPASS (20h) command is used to place the device in unlock bypass
mode. Three bus WRITE operations are required to issue the UNLOCK BYPASS command.
When the device enters unlock bypass mode, the two initial UNLOCK cycles required
for a standard PROGRAM or ERASE operation are not needed, thus enabling faster total
program or erase time.
The UNLOCK BYPASS command is used in conjunction with UNLOCK BYPASS PROGRAM or UNLOCK BYPASS ERASE commands to program or erase the device faster
than with standard PROGRAM or ERASE commands. Using these commands can save
considerable time when the cycle time to the device is long. When in unlock bypass
mode, only the following commands are valid:
• The UNLOCK BYPASS PROGRAM command can be issued to program addresses
within the device.
• The UNLOCK BYPASS BLOCK ERASE command can then be issued to erase one or
more memory blocks.
• The UNLOCK BYPASS CHIP ERASE command can be issued to erase the whole memory array.
• The UNLOCK BYPASS WRITE TO BUFFER PROGRAM and UNLOCK BYPASS ENHANCED WRITE TO BUFFER PROGRAM commands can be issued to speed up the
programming operation.
• The UNLOCK BYPASS RESET command can be issued to return the device to read
mode.
In unlock bypass mode, the device can be read as if in read mode.
In addition to the UNLOCK BYPASS command, when V PP/WP# is raised to V PPH, the device automatically enters unlock bypass mode. When V PP/WP# returns to V IH or V IL, the
device is no longer in unlock bypass mode, and normal operation resumes. The transitions from V IH to V PPH and from V PPH to V IH must be slower than tVHVPP. (See the Accelerated Program, Data Polling/Toggle AC Characteristics.)
Note: Micron recommends entering and exiting unlock bypass mode using the ENTER
UNLOCK BYPASS and UNLOCK BYPASS RESET commands rather than raising V PP/WP#
to V PPH. V PP/WP# should never be raised to V PPH from any mode except read mode; otherwise, the device may be left in an indeterminate state. V PP/WP# should not remain at
VPPH for than 80 hours cumulative.
UNLOCK BYPASS RESET Command
The UNLOCK BYPASS RESET (90/00h) command is used to return to read/reset mode
from unlock bypass mode. Two bus WRITE operations are required to issue the UNLOCK BYPASS RESET command. The READ/RESET command does not exit from unlock bypass mode.
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Program Operations
Program Operations
PROGRAM Command
The PROGRAM (A0h) command can be used to program a value to one address in the
memory array. The command requires four bus WRITE operations; the final WRITE operation latches the address and data in the internal state machine and starts the program/erase controller. After programming has started, bus READ operations output the
status register content.
Programming can be suspended and then resumed by issuing a PROGRAM SUSPEND
command and a PROGRAM RESUME command, respectively.
If the address falls in a protected block, the PROGRAM command is ignored, and the
data remains unchanged. The status register is not read, and no error condition is given.
After the PROGRAM operation has completed, the device returns to read mode, unless
an error has occurred. When an error occurs, bus READ operations to the device continue to output the status register. A READ/RESET command must be issued to reset the
error condition and return the device to read mode.
The PROGRAM command cannot change a bit set to 0 back to 1, and an attempt to do
so is masked during a PROGRAM operation. Instead, an ERASE command must be used
to set all bits in one memory block or in the entire memory from 0 to 1.
The PROGRAM operation is aborted by performing a reset or by powering-down the device. In this case, data integrity cannot be ensured, and the words or bytes that were
aborted should be reprogrammed.
UNLOCK BYPASS PROGRAM Command
When the device is in unlock bypass mode, the UNLOCK BYPASS PROGRAM (A0h)
command can be used to program one address in the memory array. The command requires two bus WRITE operations instead of four required by a standard PROGRAM
command; the final WRITE operation latches the address and data and starts the program/erase controller. (The standard PROGRAM command requires four bus WRITE
operations.) The PROGRAM operation using the UNLOCK BYPASS PROGRAM command behaves identically to the PROGRAM operation using the PROGRAM command.
The operation cannot be aborted. A bus READ operation to the memory outputs the
status register.
WRITE TO BUFFER PROGRAM Command
The WRITE TO BUFFER PROGRAM (25h) command makes use of the 32-word program
buffer to speed up programming. A maximum of 32 words can be loaded into the program buffer. The WRITE TO BUFFER PROGRAM command dramatically reduces system
programming time compared to the standard non-buffered PROGRAM command.
When issuing a WRITE TO BUFFER PROGRAM command, V PP/WP# can be either held
HIGH or raised to V PPH. Also, it can be held LOW if the block is not the lowest or highest
block, depending on the part number. The following successive steps are required to issue the WRITE TO BUFFER PROGRAM command:
First, two UNLOCK cycles are issued. Next, a third bus WRITE cycle sets up the WRITE
TO BUFFER PROGRAM command. The set-up code can be addressed to any location
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Program Operations
within the targeted block. Then, a fourth bus WRITE cycle sets up the number of words/
bytes to be programmed. Value n is written to the same block address, where n + 1 is the
number of words/bytes to be programmed. Value n + 1 must not exceed the size of the
program buffer, or the operation will abort. A fifth cycle loads the first address and data
to be programmed. Last, n bus WRITE cycles load the address and data for each word/
byte into the program buffer. Addresses must lie within the range from the start address
+1 to the start address + (n - 1).
Optimum programming performance and lower power usage are achieved by aligning
the starting address at the beginning of a 32-word boundary. Any buffer size smaller
than 32 words is allowed within a 32-word boundary, while all addresses used in the operation must lie within the 32-word boundary. In addition, any crossing boundary buffer program will result in a program abort.
To program the content of the program buffer, this command must be followed by a
WRITE TO BUFFER PROGRAM CONFIRM command.
If an address is written several times during a WRITE TO BUFFER PROGRAM operation,
the address/data counter will be decremented at each data load operation, and the data
will be programmed to the last word loaded into the buffer.
Invalid address combinations or the incorrect sequence of bus WRITE cycles will abort
the WRITE TO BUFFER PROGRAM command.
The status register bits DQ1, DQ5, DQ6, DQ7 can be used to monitor the device status
during a WRITE TO BUFFER PROGRAM operation.
The WRITE BUFFER PROGRAM command should not be used to change a bit set to 0
back to 1, and an attempt to do so is masked during the operation. Rather than the
WRITE BUFFER PROGRAM command, the ERASE command should be used to set
memory bits from 0 to 1.
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Program Operations
Figure 8: WRITE TO BUFFER PROGRAM Flowchart
Start
WRITE TO BUFFER
command,
block address
WRITE TO BUFFER
confirm, block address
Write n,1
block address
Read data polling
register (DQ1, DQ5,
DQ7) at last loaded
address
First three cycles of the
WRITE TO BUFFER
PROGRAM command
Write buffer data,
start address
DQ7 = Data
X=n
No
No
DQ1 = 1
Yes
X=0
Yes
No
Abort
WRITE TO BUFFER
Yes
No
DQ5 = 1
Yes
Check data polling
register (DQ5, DQ7)
at last loaded address
Write to a different
block address
No
Write next data,3
program address pair
Yes
WRITE TO BUFFER
and PROGRAM
aborted2
DQ7 = Data4
Yes
No
Fail or
abort5
X=X-1
Notes:
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End
1. n + 1 is the number of addresses to be programmed.
2. The BUFFERED PROGRAM ABORT and RESET command must be issued to return the device to read mode.
3. When the block address is specified, any address in the selected block address space is
acceptable. However, when loading program buffer address with data, all addresses
must fall within the selected program buffer page.
4. DQ7 must be checked because DQ5 and DQ7 may change simultaneously.
5. If this flowchart location is reached because DQ5 = 1, then the WRITE TO BUFFER PROGRAM command failed. If this flowchart location is reached because DQ1 = 1, then the
WRITE TO BUFFER PROGRAM command aborted. In both cases, the appropriate RESET
command must be issued to return the device to read mode: A RESET command if the
operation failed; a WRITE TO BUFFER PROGRAM ABORT AND RESET command if the operation aborted.
6. See the Standard Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit table for
details about the WRITE TO BUFFER PROGRAM command sequence.
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Program Operations
UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command
When the device is in unlock bypass mode, the UNLOCK BYPASS WRITE TO BUFFER
(25h) command can be used to program the device in fast program mode. The command requires two bus WRITE operations fewer than the standard WRITE TO BUFFER
PROGRAM command.
The UNLOCK BYPASS WRITE TO BUFFER PROGRAM command behaves the same way
as the WRITE TO BUFFER PROGRAM command: the operation cannot be aborted, and
a bus READ operation to the memory outputs the status register.
The WRITE TO BUFFER PROGRAM CONFIRM command is used to confirm an UNLOCK BYPASS WRITE TO BUFFER PROGRAM command and to program the n + 1
words/bytes loaded in the program buffer by this command.
WRITE TO BUFFER PROGRAM CONFIRM Command
The WRITE TO BUFFER PROGRAM CONFIRM (29h) command is used to confirm a
WRITE TO BUFFER PROGRAM command and to program the n + 1 words/bytes loaded
in the program buffer by this command.
BUFFERED PROGRAM ABORT AND RESET Command
A BUFFERED PROGRAM ABORT AND RESET (F0h) command must be issued to reset
the device to read mode when the BUFFER PROGRAM operation is aborted. The buffer
programming sequence can be aborted in the following ways:
• Load a value that is greater than the page buffer size during the number of locations
to program in the WRITE TO BUFFER PROGRAM command.
• Write to an address in a different block than the one specified during the WRITE BUFFER LOAD command.
• Write an address/data pair to a different write buffer page than the one selected by
the starting address during the program buffer data loading stage of the operation.
• Write data other than the CONFIRM command after the specified number of data
load cycles.
The abort condition is indicated by DQ1 = 1, DQ7 = DQ7# (for the last address location
loaded), DQ6 = toggle, and DQ5 = 0 (all of which are status register bits). A BUFFERED
PROGRAM ABORT and RESET command sequence must be written to reset the device
for the next operation.
Note: The full three-cycle BUFFERED PROGRAM ABORT and RESET command sequence is required when using buffer programming features in unlock bypass mode.
PROGRAM SUSPEND Command
The PROGRAM SUSPEND (B0h) command can be used to interrupt a program operation so that data can be read from any block. When the PROGRAM SUSPEND command
is issued during a program operation, the device suspends the operation within the program suspend latency time and updates the status register bits.
After the program operation has been suspended, data can be read from any address.
However, data is invalid when read from an address where a program operation has
been suspended.
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Program Operations
The PROGRAM SUSPEND command may also be issued during a PROGRAM operation
while an erase is suspended. In this case, data may be read from any address not in
erase suspend or program suspend mode. To read from the extended memory block
area (one-time programmable area), the ENTER/EXIT EXTENDED MEMORY BLOCK
command sequences must be issued.
The system may also issue the AUTO SELECT command sequence when the device is in
program suspend mode. The system can read as many auto select codes as required.
When the device exits auto select mode, the device reverts to program suspend mode
and is ready for another valid operation.
The PROGRAM SUSPEND operation is aborted by performing a device reset or powerdown. In this case, data integrity cannot be ensured, and the words or bytes that were
aborted should be reprogrammed.
PROGRAM RESUME Command
The PROGRAM RESUME (30h) command must be issued to exit a program suspend
mode and resume a PROGRAM operation. The controller can use DQ7 or DQ6 status
bits to determine the status of the PROGRAM operation. After a PROGRAM RESUME
command is issued, subsequent PROGRAM RESUME commands are ignored. Another
PROGRAM SUSPEND command can be issued after the device has resumed programming.
ENTER and EXIT ENHANCED BUFFERED PROGRAM Command
The ENHANCED BUFFERED PROGRAM commands are available only in x16 mode.
When the ENTER ENHANCED BUFFERED PROGRAM command is issued, the device
accepts only these commands, which can be executed multiple times. Monitor the toggle bit to ensure successful completion of the ENTER ENHANCED BUFFERED PROGRAM command. The EXIT ENHANCED BUFFERED PROGRAM command returns the
device to read mode; two bus WRITE operations are required to issue the command.
ENHANCED BUFFERED PROGRAM Command
The ENHANCED BUFFERED PROGRAM command makes use of a 256-word write buffer to speed up programming. Each write buffer has the same A[23:8] addresses. This
command dramatically reduces system programming time compared to both the
standard non-buffered PROGRAM command and the WRITE TO BUFFER command.
When issuing the ENHANCED BUFFERED PROGRAM command, the V PP/WP pin can
be held HIGH or raised to V PPH. (See Program/Erase Characteristics.) The following successive steps are required to issue the WRITE TO BUFFER PROGRAM command:
First, the ENTER ENHANCED BUFFERED PROGRAM command is issued. Next, one bus
WRITE cycle sets up the ENHANCED BUFFERED PROGRAM command. The set-up
code can be addressed to any location within the targeted block. Then, a second bus
WRITE cycle loads the first address and the data to be programmed. There are a total of
256 address- and data-loading cycles. When the 256 words are loaded to the buffer, a
third WRITE cycle programs the content of the buffer. Last, when the command completes, the EXIT ENHANCED BUFFERED PROGRAM command is issued.
Address/data cycles must be loaded in an increasing address order, from A[7:0] =
00000000 to A[7:0] = 11111111 until all 256 words are loaded. Invalid address combina-
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256Mb: 3V Embedded Parallel NOR Flash
Program Operations
tions or the incorrect sequence of bus WRITE cycles will abort the WRITE TO BUFFER
PROGRAM command.
The status register bits DQ1, DQ5, DQ6, DQ7 can be used to monitor the device status
during a WRITE TO BUFFER PROGRAM operation.
An external 12V supply can be used to improve programming efficiency.
When reprogramming data in a portion of memory already programmed (changing
programmed data from 0 to 1) operation failure can be detected by a logical OR between the previous and the current value.
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Program Operations
Figure 9: ENHANCED BUFFERED PROGRAM Flowchart
Start
ENHANCED BUFFERED
PROGRAM command,
block address
ENHANCED
BUFFERED PROGRAM
command set
First cycle of the
ENHANCED BUFFERED PROGRAM
command
Write buffer data,
start address (00),
X=255
Read DQ6 at
valid address
Read
DQ5 and DQ6
at valid address
Yes
X=0
No
DQ6 =
Abort WRITE
TO BUFFER
No
Yes
Write to a different
block address
toggle
No
Yes
No
ENHANCED BUFFERED
PROGRAM aborted (1)
Write next data, (2)
program address pair
DQ5 =1
Yes
Write next data, (2)
program address pair
Read DQ6
twice
at valid address
X = X-1
No
DQ6 =
toggle
ENHANCED BUFFERED
PROGRAM confirm,
block address
Yes
Fail
258th WRITE cycle of the
ENHANCED BUFFERED PROGRAM
command
Read status register
(DQ1, DQ5, DQ7) at
last loaded address
DQ7 = Data
No
DQ1 = 1
Yes
No
No
DQ5 = 1
Yes
Yes
Check status register
(DQ5, DQ7) at
last loaded address
New
Program?
Yes
No
DQ7 = Data
(3)
No
Fail or Abort(4)
Notes:
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Yes
Exit ENHANCED
BUFFERED PROGRAM
command set
End
1. The ENHANCED BUFFERED PROGRAM ABORT AND RESET command must be issued to
return the device to read mode.
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Program Operations
2. When the block address is specified, all addresses in the selected block address space
must be issued starting from 00h. Furthermore, when loading the write buffer address
with data, data program addresses must be consecutive.
3. DQ7 must be checked because DQ5 and DQ7 may change simultaneously.
4. If this flowchart location is reached because DQ5 = 1, then the ENHANCED WRITE TO
BUFFER PROGRAM command failed. If this flowchart location is reached because DQ1 =
1, then the ENHANCED WRITE TO BUFFER PROGRAM command aborted. In both cases,
the appropriate RESET command must be issued to return the device to read mode: a
RESET command if the operation failed; an ENHANCED WRITE TO BUFFER PROGRAM
ABORT AND RESET command if the operation aborted.
ENHANCED BUFFERED PROGRAM ABORT AND RESET Command
An ENHANCED BUFFERED PROGRAM ABORT AND RESET command must be issued
to reset the device to read mode when the ENHANCED BUFFERED PROGRAM operation is aborted. The buffer programming sequence can be aborted in the following
ways:
• Write to an address in a different block than the one specified during the buffer load.
• Write an address/data pair to a different write buffer page than the one selected by
the starting address during the program buffer data loading stage of the operation.
• Write data other than the CONFIRM command after the 256 data load cycles.
• Load a value that is greater than or less than the 256 buffer size.
• Load address/data pairs in an incorrect sequence.
The abort condition is indicated by DQ1 = 1, DQ6 = toggle, and DQ5 = 0 (all of which are
status register bits).
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Erase Operations
Erase Operations
CHIP ERASE Command
The CHIP ERASE (80/10h) command erases the entire chip. Six bus WRITE operations
are required to issue the command and start the program/erase controller.
Protected blocks are not erased. If all blocks are protected, the CHIP ERASE operation
appears to start, but will terminate within approximately100μs, leaving the data unchanged. No error is reported when protected blocks are not erased.
During the CHIP ERASE operation, the device ignores all other commands, including
ERASE SUSPEND. It is not possible to abort the operation. All bus READ operations during CHIP ERASE output the status register on the data I/Os. (See the Status Register section for more details.)
After the CHIP ERASE operation completes, the device returns to read mode, unless an
error has occurred. If an error occurs, the device will continue to output the status register. A READ/RESET command must be issued to reset the error condition and return to
read mode.
The CHIP ERASE command sets all of the bits in unprotected blocks of the device to 1.
All previous data is lost.
The operation is aborted by performing a reset or by powering-down the device. In this
case, data integrity cannot be ensured, and the entire chip should be erased again.
UNLOCK BYPASS CHIP ERASE Command
When the device is in unlock bypass mode, the UNLOCK BYPASS CHIP ERASE (80/10h)
command can be used to erase all memory blocks at one time. The command requires
only two bus WRITE operations instead of six using the standard CHIP ERASE command. The final bus WRITE operation starts the program/erase controller.
The UNLOCK BYPASS CHIP ERASE command behaves the same way as the CHIP
ERASE command: the operation cannot be aborted, and a bus READ operation to the
memory outputs the status register.
BLOCK ERASE Command
The BLOCK ERASE (80/30h) command erases a list of one or more blocks. It sets all of
the bits in the unprotected selected blocks to 1. All previous data in the selected blocks
is lost.
Six bus WRITE operations are required to select the first block in the list. Each additional block in the list can be selected by repeating the sixth bus WRITE operation using the
address of the additional block. After the command sequence is written, a block erase
timeout occurs. During the timeout period, additional block addresses and BLOCK
ERASE commands can be written. After the program/erase controller has started, it is
not possible to select any more blocks. Each additional block must therefore be selected
within the timeout period of the last block. The timeout timer restarts when an additional block is selected. After the sixth bus WRITE operation, a bus READ operation outputs the status register. (See the WE#-Controlled Program waveforms for details on how
to identify if the program/erase controller has started the BLOCK ERASE operation.)
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Erase Operations
After the BLOCK ERASE operation completes, the device returns to read mode, unless
an error has occurred. If an error occurs, bus READ operations will continue to output
the status register. A READ/RESET command must be issued to reset the error condition and return to read mode.
If any selected blocks are protected, they are ignored, and all the other selected blocks
are erased. If all the selected blocks are protected, the BLOCK ERASE operation appears
to start, but will terminate within approximately100μs, leaving the data unchanged. No
error condition is given when protected blocks are not erased.
During the BLOCK ERASE operation, the device ignores all commands except the
ERASE SUSPEND command and the READ/RESET command, which is accepted only
during the timeout period. The operation is aborted by performing a reset or poweringdown the device. In this case, data integrity cannot be ensured, and the aborted blocks
should be erased again.
UNLOCK BYPASS BLOCK ERASE Command
When the device is in unlock bypass mode, the UNLOCK BYPASS BLOCK ERASE
(80/30h) command can be used to erase one or more memory blocks at a time. The
command requires two bus WRITE operations instead of six using the standard BLOCK
ERASE command. The final bus WRITE operation latches the address of the block and
starts the program/erase controller.
To erase multiple blocks (after the first two bus WRITE operations have selected the first
block in the list), each additional block in the list can be selected by repeating the second bus WRITE operation using the address of the additional block.
The UNLOCK BYPASS BLOCK ERASE command behaves the same way as the BLOCK
ERASE command: the operation cannot be aborted, and a bus READ operation to the
memory outputs the status register. (See the BLOCK ERASE Command section for details.)
ERASE SUSPEND Command
The ERASE SUSPEND (B0h) command temporarily suspends a BLOCK ERASE operation. One bus WRITE operation is required to issue the command. The block address is
"Don't Care."
The program/erase controller suspends the ERASE operation within the erase suspend
latency time of the ERASE SUSPEND command being issued. However, when the
ERASE SUSPEND command is written during the block erase timeout, the device immediately terminates the timeout period and suspends the ERASE operation. After the
program/erase controller has stopped, the device operates in read mode, and the erase
is suspended.
During an ERASE SUSPEND operation, it is possible to read and execute PROGRAM operations or WRITE TO BUFFER PROGRAM operations in blocks that are not suspended.
Both READ and PROGRAM operations behave normally on these blocks. Reading from
blocks that are suspended will output the status register. If any attempt is made to program in a protected block or in the suspended block, the PROGRAM command is ignored, and the data remains unchanged. In this case, the status register is not read, and no
error condition is given.
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Erase Operations
It is also possible to issue AUTO SELECT and UNLOCK BYPASS commands during an
ERASE SUSPEND operation. The READ/RESET command must be issued to return the
device to read array mode before the RESUME command will be accepted.
During an ERASE SUSPEND operation, a bus READ operation to the extended memory
block will output the extended memory block data. After the device enters extended
memory block mode, the EXIT EXTENDED MEMORY BLOCK command must be issued
before the ERASE operation can be resumed.
An ERASE SUSPEND command is ignored if it is written during a CHIP ERASE operation.
If the ERASE SUSPEND operation is aborted by performing a device reset or powerdown, data integrity cannot be ensured, and the suspended blocks should be erased
again.
ERASE RESUME Command
The ERASE RESUME (30h) command restarts the program/erase controller after an
ERASE SUSPEND operation.
The device must be in read array mode before the RESUME command will be accepted.
An erase can be suspended and resumed more than once.
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Block Protection Command Definitions – Address/Data Cycles
Block Protection Command Definitions – Address/Data Cycles
Table 12: Block Protection Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit
Notes 1 and 2 apply to entire table
Address and Data Cycles
Command and
Code/Subcode
Bus
Size
1st
2nd
3rd
4th
A
D
A
D
A
D
x8
AAA
AA
555
55
AAA
40
x16
555
AA
2AA
55
555
x8
X
A0
X
Data
X
Data
A
nth
D
…
A
D
Notes
LOCK REGISTER Commands
ENTER LOCK REGISTER
COMMAND SET (40h)
PROGRAM LOCK REGISTER
(A0h)
x16
READ LOCK REGISTER
x8
3
5
4, 5, 6
x16
PASSWORD PROTECTION Commands
ENTER PASSWORD
PROTECTION COMMAND
SET (60h)
x8
AAA
AA
555
55
AAA
x16
555
AA
2AA
55
555
x8
X
A0
60
3
PROGRAM PASSWORD
(A0h)
x16
READ PASSWORD
x8
00
PWD0
01
PWD1
02
PWD2
03
PWD3 …
x16
00
PWD0
01
PWD1
02
PWD2
03
PWD3
x8
00
25
00
03
00
PWD0
01
PWD1 …
C0
UNLOCK PASSWORD (25h/
03h)
PWAn PWDn
7
07
00
PWD7 4, 6, 8,
9
29
8, 10
x16
NONVOLATILE PROTECTION Commands
ENTER NONVOLATILE
PROTECTION COMMAND
SET (C0h)
PROGRAM NONVOLATILE
PROTECTION BIT (A0h)
READ NONVOLATILE
PROTECTION BIT STATUS
CLEAR ALL NONVOLATILE
PROTECTION BITS (80h/
30h)
x8
AAA
AA
555
55
AAA
x16
555
AA
2AA
55
555
x8
X
A0
BAd
00
BAd
READ(0)
X
80
3
x16
x8
4, 6,
11
x16
x8
00
30
12
x16
NONVOLATILE PROTECTION BIT LOCK BIT Commands
ENTER NONVOLATILE
PROTECTION BIT LOCK BIT
COMMAND SET (50h)
PROGRAM NONVOLATILE
PROTECTION BIT LOCK BIT
(A0h)
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x8
AAA
AA
555
55
AAA
x16
555
AA
2AA
55
555
x8
X
A0
X
00
50
3
11
x16
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256Mb: 3V Embedded Parallel NOR Flash
Block Protection Command Definitions – Address/Data Cycles
Table 12: Block Protection Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit (Continued)
Notes 1 and 2 apply to entire table
Address and Data Cycles
1st
2nd
3rd
Command and
Code/Subcode
Bus
Size
A
D
READ NONVOLATILE
PROTECTION BIT LOCK BIT
STATUS
x8
X
READ(0)
x16
x8
AAA
AA
555
55
AAA
x16
555
AA
2AA
55
555
x8
X
A0
BAd
00
BAd
READ(0)
X
A0
BAd
01
A
D
A
4th
D
A
nth
D
…
A
D
Notes
4, 6,
11
VOLATILE PROTECTION Commands
ENTER VOLATILE
PROTECTION COMMAND
SET (E0h)
PROGRAM VOLATILE
PROTECTION BIT (A0h)
READ VOLATILE
PROTECTION BIT STATUS
CLEAR VOLATILE
PROTECTION BIT (A0h)
E0
3
x16
x8
4, 6,
11
x16
x8
x16
EXTENDED MEMORY BLOCK Commands
ENTER EXTENDED
MEMORY BLOCK (88h)
x8
AAA
AA
555
55
AAA
x16
555
AA
2AA
55
555
EXIT EXTENDED
MEMORY BLOCK (90h/00h)
x8
AAA
AA
555
55
AAA
x16
555
AA
2AA
55
555
X
90
X
00
88
90
3
X
00
EXIT PROTECTION Commands
EXIT PROTECTION
COMMAND SET (90h/00h)
Notes:
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x8
3
x16
1. Key: A = Address and D = Data; X = "Don’t Care"; BAd = Any address in the block; PWDn
= Password bytes 0 to 7; PWAn = Password address, n = 0 to 7; Gray = Not applicable. All
values in the table are hexadecimal.
2. DQ[15:8] are "Don’t Care" during UNLOCK and COMMAND cycles. A[MAX:16] are
"Don’t Care" during UNLOCK and COMMAND cycles, unless an address is required.
3. The ENTER command sequence must be issued prior to any operation. It disables READ
and WRITE operations from and to block 0. READ and WRITE operations from and to
any other block are allowed. Also, when an ENTER COMMAND SET command is issued,
an EXIT PROTECTION COMMAND SET command must be issued to return the device to
READ mode.
4. READ REGISTER/PASSWORD commands have no command code; CE# and OE# are driven
LOW, and data is read according to a specified address.
5. Data = Lock register content.
6. All address cycles shown for this command are READ cycles.
7. Only one portion of the password can be programmed or read by each PROGRAM PASSWORD command.
8. Each portion of the password can be entered or read in any order as long as the entire
64-bit password is entered or read.
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Block Protection Command Definitions – Address/Data Cycles
9. For the x8 READ PASSWORD command, the nth (and final) address cycle equals the
eighth address cycle. From the fifth to the eighth address cycle, the values for each address and data pair continue the pattern shown in the table as follows: for x8, address
and data = 04 and PWD4; 05 and PWD5; 06 and PWD6; 07 and PWD7.
10. For the x8 UNLOCK PASSWORD command, the nth (and final) address cycle equals the
eleventh address cycle. From the fifth to the tenth address cycle, the values for each address and data pair continue the pattern shown in the table as follows: address and data
= 02 and PWD2; 03 and PWD3; 04 and PWD4; 05 and PWD5; 06 and PWD6; 07 and
PWD7.
For the x16 UNLOCK PASSWORD command, the nth (and final) address cycle equals the
seventh address cycle. For the fifth and sixth address cycles, the values for the address
and data pair continue the pattern shown in the table as follows: address and data = 02
and PWD2; 03 and PWD3.
11. Both nonvolatile and volatile protection bit settings are as follows: Protected state = 00;
Unprotected state= 01.
12. The CLEAR ALL NONVOLATILE PROTECTION BITS command programs all nonvolatile protection bits before erasure. This prevents over-erasure of previously cleared nonvolatile
protection bits.
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Protection Operations
Protection Operations
Blocks can be protected individually against accidental PROGRAM, ERASE, or READ operations on both 8-bit and 16-bit configurations. The block protection scheme is shown
in the Software Protection Scheme figure. Memory block and extended memory block
protection is configured through the lock register.
LOCK REGISTER Commands
The ENTER LOCK REGISTER COMMAND SET (40h) command enables execution of all
READ or PROGRAM LOCK REGISTER commands. PROGRAM LOCK REGISTER (A0h)
configures the lock register, and READ LOCK REGISTER reads/confirms programmed
data.
PASSWORD PROTECTION Commands
The ENTER PASSWORD PROTECTION COMMAND SET (60h) command enables execution of password protection commands. PROGRAM PASSWORD (A0h) programs the 64bit password used in the password protection mode. To program the 64-bit password in
8-bit mode, the complete command sequence must be entered eight times at eight consecutive addresses selected by A[1:0] plus DQ15/A-1; in 16-bit mode, the command sequence must be entered four times at four consecutive addresses selected by A[1:0]. By
default, all password bits are set to 1. The password can be checked by issuing a READ
PASSWORD command.
READ PASSWORD verifies the password used in password protection mode. To verify
the 64-bit password in 8-bit mode, the complete command sequence must be entered
eight times at eight consecutive addresses selected by A[1:0] plus DQ15/A-1. In 16-bit
mode, the command sequence must be entered four times at four consecutive addresses selected by A[1:0]. If the password mode lock bit is programmed, and a user attempts
to read the password, the device outputs FFh.
UNLOCK PASSWORD (25/03h) clears the nonvolatile protection bit lock bit, allowing
the nonvolatile protection bits to be modified. UNLOCK PASSWORD must be issued
with the correct password and requires a 1μs delay between successive UNLOCK PASSWORD commands. The delay helps prevent password intruders from trying all possible
64-bit combinations. If the delay does not occur, the latest command is ignored. After a
valid 64-bit password is entered, approximately 1μs is required to unlock the device.
NONVOLATILE PROTECTION Commands
The ENTER NONVOLATILE PROTECTION COMMAND SET (C0h) command enables
nonvolatile protection mode commands to be issued to the device. A block can be protected from PROGRAM or ERASE operations using a PROGRAM NONVOLATILE PROTECTION BIT (A0h) command, along with the block address. This command sets the
nonvolatile protection bit to 0 for a given block.
The status of a nonvolatile protection bit for a given block or group of blocks can be
read using a READ NONVOLATILE MODIFY PROTECTION BIT command, along with
the block address. The nonvolatile protection bits are erased simultaneously using a
CLEAR ALL NONVOLATILE PROTECTION BITS (80/30h) command. No specific block
address is required. If the nonvolatile protection bit lock bit is set to 0, the command
fails.
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Protection Operations
Figure 10: Program/Erase Nonvolatile Protection Bit Algorithm
Start
ENTER NONVOLATILE
PROTECTION
command set
PROGRAM NONVOLATILE
PROTECTION BIT
Addr = BAd
Read byte twice
Addr = BAd
DQ6 = Toggle
No
Yes
No
DQ5 = 1
Wait 500µs
Yes
Read byte twice
Addr = BAd
DQ6 = Toggle
No
Read byte twice
Addr = BAd
Yes
No
DQ0 =
1 (erase)
0 (program)
Yes
Fail
Reset
Pass
EXIT PROTECTION
command set
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Protection Operations
NONVOLATILE PROTECTION BIT LOCK BIT Commands
After the ENTER NONVOLATILE PROTECTION BIT LOCK BIT COMMAND SET (50h)
command has been issued, the commands that allow the nonvolatile protection bit lock
bit to be set can be issued to the device.
The PROGRAM NONVOLATILE PROTECTION BIT LOCK BIT (A0h) command is used to
set the nonvolatile protection bit lock bit to 0, thus locking the nonvolatile protection
bits and preventing them from being modified.
The READ NONVOLATILE PROTECTION BIT LOCK BIT STATUS command is used to
read the status of the nonvolatile protection bit lock bit.
VOLATILE PROTECTION Commands
After the ENTER VOLATILE PROTECTION COMMAND SET (E0h) command has been
issued, commands related to the volatile protection mode can be issued to the device.
The PROGRAM VOLATILE PROTECTION BIT (A0h) command individually sets a volatile protection bit to 0 for a given block. If the nonvolatile protection bit for the same
block is set, the block is locked regardless of the value of the volatile protection bit. (See
the Block Protection Status table.)
The status of a volatile protection bit for a given block can be read by issuing a READ
VOLATILE PROTECTION BIT STATUS command along with the block address.
The CLEAR VOLATILE PROTECTION BIT (A0h) command individually clears (sets to 1)
the volatile protection bit for a given block. If the nonvolatile protection bit for the same
block is set, the block is locked regardless of the value of the volatile protection bit. (See
the Block Protection Status table.)
EXTENDED MEMORY BLOCK Commands
The device has one extra 128-word extended memory block that can be accessed only
by the ENTER EXTENDED MEMORY BLOCK (88h) command. The extended memory
block is 128 words (x16) or 256 bytes (x8). It is used as a security block to provide a permanent 128-bit security identification number or to store additional information. The
device can be shipped with the extended memory block prelocked permanently by Micron, including the 128-bit security identification number. Or, the device can be shipped with the extended memory block unlocked, enabling customers to permanently
program and lock it. (See Lock Register, the AUTO SELECT command, and the Block
Protection table.)
Table 13: Extended Memory Block Address and Data
Address
Data
x8
x16
Micron-Prelocked
Customer-Lockable
000000h–0000FFh
000000h–00007Fh
Secure ID number
Determined by customer
After the ENTER EXTENDED MEMORY BLOCK command has been issued, the device
enters the extended memory block mode. All bus READ or PROGRAM operations are
conducted on the extended memory block, and the extended memory block is addressed using the addresses occupied by block 0 in the other operating modes. (See the
Memory Map table.)
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Protection Operations
In extended memory block mode, ERASE, CHIP ERASE, ERASE SUSPEND, and ERASE
RESUME commands are not allowed. The extended memory block cannot be erased,
and each bit of the extended memory block can only be programmed once.
The extended memory block is protected from further modification by programming
lock register bit 0. Once invoked, this protection cannot be undone.
The device remains in extended memory block mode until the EXIT EXTENDED MEMORY BLOCK (90/00h) command is issued, which returns the device to read mode, or
until power is removed from the device. After a power-up sequence or hardware reset,
the device will revert to reading memory blocks in the main array.
EXIT PROTECTION Command
The EXIT PROTECTION COMMAND SET (90/00h) command is used to exit the lock
register, password protection, nonvolatile protection, volatile protection, and nonvolatile protection bit lock bit command set modes and return the device to read mode.
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Device Protection
Device Protection
Hardware Protection
The V PP/WP# function provides a hardware method of protecting the highest or lowest
block. When V PP/WP# is LOW, PROGRAM and ERASE operations on either of these
blocks is ignored to provide protection. When V PP/WP# is HIGH, the device reverts to
the previous protection status for the highest or lowest block. PROGRAM and ERASE
operations can modify the data in this block unless the block is protected using block
protection.
When V PP/WP# protect is raised to V PPH, the device automatically enters the unlock bypass mode, and command execution time is faster. This must never be done from any
mode except read mode; otherwise, the device might be left in an indeterminate state.
A 0.1μF capacitor should be connected between V PP/WP# and the V SS ground pin to decouple the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required during unlock bypass program.
When V PP/WP# returns to HIGH or LOW, normal operation resumes. When operations
execute in unlock bypass mode, the device draws IPP from the pin to supply the programming circuits. Transitions from HIGH to V PPH and from V PPH to LOW must be slower than tVHVPP.
Note: Micron highly recommends driving V PP/WP# HIGH or LOW. If a system needs to
float V PP/WP#, without a pull-up/pull-down resistor and no capacitor, then an internal
pull-up resistor is enabled.
Table 14: VPP/WP# Functions
VPP/WP# Settings
Function
VIL
Highest (29WxxxGH) or lowest (29WxxxGL) block is protected.
VIH
Highest or lowest block is unprotected unless software protection is activated.
VPPH
Unlock bypass mode supplies current necessary to speed up PROGRAM execution time.
Software Protection
Software protection includes volatile, nonvolatile, and password protection as well as
password access. The device is shipped with all blocks unprotected. On first use, the device defaults to the nonvolatile protection mode but can be activated in either the nonvolatile protection or password protection mode.
The desired protection mode is activated by setting either the nonvolatile protection
mode lock bit or the password protection mode lock bit of the lock register. (See the
Lock Register section.) Both bits are one-time-programmable and nonvolatile; therefore, after the protection mode has been activated, it cannot be changed, and the device
is set permanently to operate in the selected protection mode. It is recommended that
the desired software protection mode be activated when first programming the device.
For the lowest and highest blocks, a higher level of block protection can be achieved by
locking the blocks using nonvolatile protection mode and holding V PP /WP# LOW.
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Device Protection
Blocks with volatile protection and nonvolatile protection can coexist within the memory array. If the user attempts to program or erase a protected block, the device ignores
the command and returns to read mode.
The block protection status can be read by performing a read electronic signature or by
issuing an AUTO SELECT command. (See the Block Protection table.)
Refer to the Block Protection Status table and the Software Protection Scheme figure for
details on the block protection scheme. Refer to the Protection Operations section for a
description of the command sets.
Volatile Protection Mode
Volatile protection enables the software application to protect blocks against inadvertent change and can be disabled when changes are needed. Volatile protection bits are
unique for each block and can be individually modified. Volatile protection bits control
the protection scheme only for unprotected blocks whose nonvolatile protection bits
are cleared to 1. Issuing a PROGRAM VOLATILE PROTECTION BIT or CLEAR VOLATILE
PROTECTION BIT command sets to 0 or clears to 1 the volatile protection bits and places the associated blocks in the protected (0) or unprotected (1) state, respectively. The
volatile protection bit can be set or cleared as often as needed.
When the device is first shipped, or after a power-up or hardware reset, the volatile protection bits default to 1 (unprotected).
Nonvolatile Protection Mode
A nonvolatile protection bit is assigned to each block. Each of these bits can be set for
protection individually by issuing a PROGRAM NONVOLATILE PROTECTION BIT command. Also, each device has one global volatile bit called the nonvolatile protection bit
lock bit; it can be set to protect all nonvolatile protection bits at once. This global bit
must be set to 0 only after all nonvolatile protection bits are configured to the desired
settings. When set to 0, the nonvolatile protection bit lock bit prevents changes to the
state of the nonvolatile protection bits. When cleared to 1, the nonvolatile protection
bits can be set and cleared using the PROGRAM NONVOLATILE PROTECTION BIT and
CLEAR ALL NONVOLATILE PROTECTION BITS commands, respectively.
No software command unlocks the nonvolatile protection bit lock bit unless the device
is in password protection mode; in nonvolatile protection mode, the nonvolatile protection bit lock bit can be cleared only by taking the device through a hardware reset or
power-up.
Nonvolatile protection bits cannot be cleared individually; they must be cleared all at
once using a CLEAR ALL NONVOLATILE PROTECTION BITS command. They will remain set through a hardware reset or a power-down/power-up sequence.
If one of the nonvolatile protection bits needs to be cleared (unprotected), additional
steps are required. First, the nonvolatile protection bit lock bit must be cleared to 1, using either a power-cycle or hardware reset. Then, the nonvolatile protection bits can be
changed to reflect the desired settings. Finally, the nonvolatile protection bit lock bit
must be set to 0 to lock the nonvolatile protection bits. The device now will operate normally.
To achieve the best protection, the PROGRAM NONVOLATILE PROTECTION LOCK BIT
command should be executed early in the boot code, and the boot code should be protected by holding V PP/WP# LOW.
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256Mb: 3V Embedded Parallel NOR Flash
Device Protection
Nonvolatile protection bits and volatile protection bits have the same function when
VPP/WP# is HIGH or when V PP/WP# is at the voltage for program acceleration (VPPH ).
Password Protection Mode
Password protection mode provides a higher level of security than the nonvolatile protection mode by requiring a 64-bit password to unlock the nonvolatile protection bit
lock bit. In addition to this password requirement, the nonvolatile protection bit lock
bit is set to 0 after power-up and reset to maintain the device in password protection
mode.
Executing the UNLOCK PASSWORD command by entering the correct password clears
the nonvolatile protection bit lock bit, enabling the block nonvolatile protection bits to
be modified. If the password provided is incorrect, the nonvolatile protection bit lock
bit remains locked, and the state of the nonvolatile protection bits cannot be modified.
To place the device in password protection mode, the following two steps are required:
First, before activating the password protection mode, a 64-bit password must be set
and the setting verified. Password verification is allowed only before the password protection mode is activated. Next, password protection mode is activated by programming the password protection mode lock bit to 0. This operation is irreversible. After the
bit is programmed, it cannot be erased, the device remains permanently in password
protection mode, and the 64-bit password can be neither retrieved nor reprogrammed.
In addition, all commands to the address where the password is stored are disabled.
Note: There is no means to verify the password after password protection mode is enabled. If the password is lost after enabling the password protection mode, there is no
way to clear the nonvolatile protection bit lock bit.
Figure 11: Software Protection Scheme
Volatile protection bit
1 = unprotected
0 = protected
(Default setting depends on the product order option)
Volatile
protection
Nonvolatile protection bit
1 = unprotected (default)
0 = protected
Nonvolatile
protection
Nonvolatile protection bit lock bit (volatile)
Array block
1 = unlocked (default, after power-up or hardware reset)
0 = locked
Nonvolatile protection
mode
Notes:
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Password protection
mode
1. Volatile protection bits are programmed and cleared individually. Nonvolatile protection
bits are programmed individually and cleared collectively.
2. Once programmed to 0, the nonvolatile protection bit lock bit can be reset to 1 only by
taking the device through a power-up or hardware reset.
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Common Flash Interface
Common Flash Interface
The common Flash interface (CFI) is a JEDEC-approved, standardized data structure
that can be read from the Flash memory device. It allows a system's software to query
the device to determine various electrical and timing parameters, density information,
and functions supported by the memory. The system can interface easily with the device, enabling the software to upgrade itself when necessary.
When the READ CFI command is issued, the device enters CFI query mode, and the data structure is read from memory. The following tables show the addresses (A-1, A[7:0])
used to retrieve the data. The query data is always presented on the lowest order data
outputs (DQ[7:0]), and the other data outputs (DQ[15:8]) are set to 0.
Table 15: Query Structure Overview
Note 1 applies to entire table
Address
x16
x8
Subsection Name
Description
10h
20h
CFI query identification string
Command set ID and algorithm data offset
1Bh
36h
System interface information
Device timing and voltage information
27h
4Eh
Device geometry definition
Flash device layout
40h
80h
Primary algorithm-specific extended query table
Additional information specific to the primary algorithm (optional)
61h
C2h
Security code area
64-bit unique device number
Note:
1. Query data are always presented on the lowest order data outputs (DQ[7:0]). DQ[15:8]
are set to 0.
Table 16: CFI Query Identification String
Note 1 applies to entire table
Address
x16
x8
Data
Description
10h
20h
0051h
Query unique ASCII string "QRY"
11h
22h
0052h
"R"
12h
24h
0059h
"Y"
13h
14h
26h
28h
0002h
0000h
Primary algorithm command set and control interface ID code 16-bit ID
code defining a specific algorithm
15h
16h
2Ah
2Ch
0040h
0000h
Address for primary algorithm extended query table (See the Primary Algorithm-Specific Extended Query Table.)
17h
18h
2Eh
30h
0000h
0000h
Alternate vendor command set and control interface ID code second vendor-specified algorithm supported
–
19h
1Ah
32h
34h
0000h
0000h
Address for alternate algorithm extended query table
–
Note:
1. Query data are always presented on the lowest-order data outputs (DQ[7:0]). DQ[15:8]
are set to 0.
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Value
50
"Q"
–
P = 40h
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256Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
Table 17: CFI Query System Interface Information
Note 1 applies to entire table
Address
x16
x8
Data
Description
Value
1Bh
36h
0027h
VCC logic supply minimum program/erase voltage
Bits[7:4] BCD value in volts
Bits[3:0] BCD value in 100mV
2.7V
1Ch
38h
0036h
VCC logic supply maximum program/erase voltage
Bits[7:4] BCD value in volts
Bits[3:0] BCD value in 100mV
3.6V
1Dh
3Ah
00B5h
VPPH (programming) supply minimum program/erase voltage
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
11.5V
1Eh
3Ch
00C5h
VPPH (programming) supply maximum program/erase voltage
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
12.5V
1Fh
3Eh
0004h
Typical timeout for single byte/word program = 2nμs
16µs
20h
40h
0004h
Typical timeout for maximum size buffer program =
21h
42h
0009h
Typical timeout per individual block erase = 2nms
22h
23h
44h
46h
0011h
0004h
Typical timeout for full chip erase =
2nμs
2nms
2n
times typical
24h
48h
0004h
Maximum timeout for buffer program =
25h
4Ah
0003h
Maximum timeout per individual block erase = 2n times typical
26h
4Ch
0004h
Note:
Maximum timeout for chip erase =
2n
0.5s
80s
Maximum timeout for byte/word program =
2n
16µs
times typical
times typical
200µs
200µs
2.3s
800s
1. The values in this table are valid for both packages.
Table 18: Device Geometry Definition
Address
x16
x8
Data
Description
Value
27h
4Eh
0019h
Device size = 2n in number of bytes
32MB
28h
29h
50h
52h
0002h
0000h
Flash device interface code description
2Ah
2Bh
54h
56h
0006h
0000h
Maximum number of bytes in multibyte program or page =
2n
64B
2Ch
58h
0001h
Number of erase block regions. It specifies the number of
regions containing contiguous erase blocks of the same size.
1
2Dh
2Eh
5Ah
5Ch
00FFh
0000h
Erase block region 1 information
Number of identical-size erase blocks = 00FFh + 1
2Fh
30h
5Eh
60h
0000h
0002h
Erase block region 1 information
Block size in region 1 = 0200h × 256 bytes
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51
x8, x16
asynchronous
256 block
128KB
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256Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
Table 18: Device Geometry Definition (Continued)
Address
x16
x8
Data
Description
Value
31h
32h
33h
34h
62h
64h
66h
68h
0000h
0000h
0000h
0000h
Erase block region 2 information
0
35h
36h
37h
38h
6Ah
6Ch
6Eh
70h
0000h
0000h
0000h
0000h
Erase block region 3 information
0
39h
3Ah
3Bh
3Ch
72h
74h
76h
78h
0000h
0000h
0000h
0000h
Erase block region 4 information
0
Table 19: Primary Algorithm-Specific Extended Query Table
Note 1 applies to entire table
Address
x16
x8
Data
Description
40h
80h
0050h
Primary algorithm extended query table unique ASCII string “PRI”
41h
82h
0052h
"R"
42h
84h
0049h
"I"
43h
86h
0031h
Major version number, ASCII
"1"
44h
88h
0033h
Minor version number, ASCII
"3"
45h
8Ah
0010h
Address-sensitive unlock (bits[1:0]):
00 = Required
01 = Not required
Silicon revision number (bits[7:2])
46h
8Ch
0002h
Erase suspend:
00 = Not supported
01 = Read only
02 = Read and write
2
47h
8Eh
0001h
Block protection:
00 = Not supported
x = Number of blocks per group
1
48h
90h
0000h
Temporary block unprotect:
00 = Not supported
01 = Supported
00
49h
92h
0008h
Block protect/unprotect:
06 = M29W256GH/M29W256GL
06
4Ah
94h
0000h
Simultaneous operations:
Not supported
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Value
52
"P"
Yes
65nm
–
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256Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
Table 19: Primary Algorithm-Specific Extended Query Table (Continued)
Note 1 applies to entire table
Address
x16
x8
Data
Description
4Bh
96h
0000h
Burst mode:
00 = Not supported
01 = Supported
00
4Ch
98h
0002h
Page mode:
00 = Not supported
02 = 8-word page
02
4Dh
9Ah
00B5h
VPPH supply minimum program/erase voltage:
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
11.5V
4Eh
9Ch
00C5h
VPPH supply maximum program/erase voltage:
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
12.5V
4Fh
9Eh
00xxh
Top/bottom boot block flag:
xx = 04h: M29W256GL, first block protected by VPP/WP#
xx = 05h: M29W256GH, last block protected by VPP/WP#
50h
A0h
0001h
Program suspend:
00 = Not supported
01 = Supported
Note:
Value
Uniform +
VPP/WP# protecting highest or
lowest block
01
1. The values in this table are valid for both packages.
Table 20: Security Code Area
Address
x16
x8
Data
Description
61h
C3h, C2h
XXXX
64-bit unique device number
62h
C5h, C4h
XXXX
63h
C7h, C6h
XXXX
64h
C9h, C8h
XXXX
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256Mb: 3V Embedded Parallel NOR Flash
Power-Up and Reset Characteristics
Power-Up and Reset Characteristics
Table 21: Power-Up Wait Timing Specifications
Note 1 applies to entire table
Symbol
Parameter
VCC HIGH to CE# LOW
VCCQ HIGH to CE# LOW
VCC HIGH to WE# LOW
VCCQ HIGH to WE# LOW
Notes:
Legacy
JEDEC
Min
Unit
Notes
tVCH
tVCHEL
55
µs
2, 3
–
tVCQHEL
55
µs
2, 3
–
tVCHWL
500
µs
–
tVCQHWL
500
ns
1. Specifications apply to 60, 70, and 80ns devices unless otherwise noted. The 60ns device
is available upon customer request.
2. VCC and VCCQ ramps must be synchronized during power-up.
3. If RST# is not stable for tVCS or tVIOS, the device will not allow any READ or WRITE operations, and a hardware reset is required.
Figure 12: Power-Up Timing
tVCHEL
VCC
VCCQ
tVCQHEL
CE#
WE#
tVCHWL
tVCQHWL
RST#
tRH
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256Mb: 3V Embedded Parallel NOR Flash
Power-Up and Reset Characteristics
Table 22: Reset AC Specifications
Note 1 applies to entire table
Symbol
Condition/Parameter
Legacy
JEDEC
Min
Max
Unit
Notes
RST# LOW to read mode during program or
erase
tREADY
tPLRH
–
55
µs
2
RST# pulse width
tRP
tPLPH
20
–
µs
RST# HIGH to CE# LOW, OE# LOW
tRH
tPHEL,
55
–
ns
20
–
µs
55
–
µs
0
–
ns
2
tPHGL,
tPHWL
tRPD
RST# LOW to standby mode during read mode
–
RST# LOW to standby mode during program or
erase
tRB
RY/BY# HIGH to CE# LOW, OE# LOW
tRHEL,
2
tRHGL,
tRHWL
Notes:
1. Specifications apply to 60, 70, and 80ns devices unless otherwise noted. The 60ns device
is available upon customer request.
2. Sampled only; not 100% tested.
Figure 13: Reset AC Timing – No PROGRAM/ERASE Operation in Progress
RY/BY#
CE#, OE#, WE#
tRH
RST#
tRP
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256Mb: 3V Embedded Parallel NOR Flash
Power-Up and Reset Characteristics
Figure 14: Reset AC Timing During PROGRAM/ERASE Operation
tREADY
RY/BY#
tRB
CE#, OE#, WE#
tRH
RST#
tRP
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256Mb: 3V Embedded Parallel NOR Flash
Absolute Ratings and Operating Conditions
Absolute Ratings and Operating Conditions
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability.
Table 23: Absolute Maximum/Minimum Ratings
Parameter
Symbol
Min
Max
Unit
Temperature under bias
TBIAS
–50
125
°C
Storage temperature
TSTG
–65
150
°C
I/O voltage
VIO
–0.6
VCC + 0.6
V
Supply voltage
VCC
–0.6
4
V
I/O supply voltage
VCCQ
–0.6
4
V
VID
–0.6
13.5
V
VPPH
–0.6
13.5
V
Identification voltage
Program voltage
Notes:
Notes
1, 2
3
1. During signal transitions, minimum voltage may undershoot to −2V for periods less than
20ns.
2. During signal transitions, maximum voltage may overshoot to VCC + 2V for periods less
than 20ns.
3. VPPH must not remain at 12V for more than 80 hours cumulative.
Table 24: Operating Conditions
Note 1 applies to entire table
Parameter
Symbol
Min
Max
Unit
Supply voltage
VCC
2.7
3.6
V
Input/output supply voltage (VCCQ ≤ VCC)
VCCQ
1.65
3.6
V
Ambient operating temperature (range 1)
TA
0
70
°C
Ambient operating temperature (range 6)
TA
–40
125
°C
Load capacitance
CL
Input rise and fall times
–
Input pulse voltages
–
0 to VCCQ
V
Input and output timing reference voltages
–
VCCQ/2
V
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
30
–
Notes
2
pF
10
ns
1. Specifications apply to 60, 70, and 80ns devices unless otherwise noted. The 60ns device
is available upon customer request.
2. For the 80ns device, I/O supply voltage (VCCQ ≤ VCC) = 1.65V (MIN) and 3.6V (MAX). For
the 60ns and 70ns devices, I/O supply voltage (VCCQ ≤ VCC) = 2.7V (MIN) and 3.6V (MAX).
57
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256Mb: 3V Embedded Parallel NOR Flash
Absolute Ratings and Operating Conditions
Figure 15: AC Measurement Load Circuit
VCCQ
VPP
VCC
25kΩ
Device
under
test
CL
0.1µF
25kΩ
0.1µF
Note:
1. CL includes jig capacitance.
Figure 16: AC Measurement I/O Waveform
VCCQ
VCCQ/2
0V
Table 25: I/O Capacitance1
Parameter
Input capacitance
Output capacitance
Note:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
Symbol
Test Condition
Min
Max
Unit
CIN
VIN = 0V
–
6
pF
COUT
VOUT = 0V
–
12
pF
1. Sampled only; not 100% tested.
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DC Characteristics
DC Characteristics
Table 26: DC Current Characteristics
Parameter
Input leakage current
Symbol
Conditions
Min
Typ
Max
Unit
Notes
ILI
0V ≤ VIN ≤ VCC
–
–
±1
µA
1
Output leakage current
ILO
0V ≤ VOUT ≤ VCC
–
–
±1
µA
VCC read
current
ICC1
CE# = VIL, OE# = VIH,
f = 6 MHz
–
–
10
mA
CE# = VIL, OE# = VIH,
f = 10 MHz
–
–
1
mA
CE# = VCCQ ±0.2V,
RST# = VCCQ ±0.2V
–
–
100
µA
Random read
Page read
VCC standby
current
Grade 6
ICC2
Grade 3
VCC program/erase current
VPP current
ICC3
Program/
erase
controller
active
–
–
200
µA
2
VPP/WP# =
VIL or VIH
–
–
20
mA
3
VPP/WP# =
VPPH
–
–
15
mA
5
µA
IPP1
VPP/WP# ≤ VCC
–
1
–
1
5
µA
Reset
IPP2
RST# = VSS ±0.2V
–
1
5
µA
PROGRAM operation
ongoing
IPP3
VPP/WP# = 12V ±5%
–
1
10
mA
VPP/WP# = VCC
–
1
5
µA
ERASE operation
ongoing
IPP4
Read
Standby
Notes:
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2
VPP/WP# = 12V ±5%
–
3
10
mA
VPP/WP# = VCC
–
1
5
µA
1. The maximum input leakage current is ±5µA on the VPP/WP# pin.
2. When the bus is inactive for tAVQV + 30ns or more, the memory enters automatic standby.
3. Sampled only; not 100% tested.
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DC Characteristics
Table 27: DC Voltage Characteristics
Parameter
Input LOW voltage
Symbol
Conditions
Min
Typ
Max
Unit
VIL
VCC ≥ 2.7V
–0.5
–
0.3VCCQ
V
Input HIGH voltage
VIH
VCC ≥ 2.7V
0.7VCCQ
–
VCCQ + 0.4
V
Output LOW voltage
VOL
IOL = 100µA,
VCC = VCC,min,
VCCQ = VCCQ,min
–
–
0.15VCCQ
V
Output HIGH voltage
VOH
IOH = 100µA,
VCC = VCC,min,
VCCQ = VCCQ,min
0.85VCCQ
–
–
V
Identification voltage
VID
–
11.5
–
12.5
V
Voltage for VPP/WP# program
acceleration
VPPH
–
11.5
–
12.5
V
Program/erase lockout supply
voltage
VLKO
–
1.8
–
2.5
V
Note:
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Notes
1
1. Sampled only; not 100% tested.
60
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Read AC Characteristics
Read AC Characteristics
Table 28: Read AC Characteristics
Symbol
Parameter
60ns
VCCQ = VCC
70ns
VCCQ = VCC
80ns
VCCQ =
1.65V to
VCC
Legacy
JEDEC
Condition
Min
Max
Min
Max
Min
Max
Unit
tRC
tAVAV
CE# = VIL,
OE# = VIL
60
–
70
–
80
–
ns
Address valid to output
valid
tACC
tAVQV
CE# = VIL,
OE# = VIL
–
60
–
70
–
80
ns
Address valid to output
valid (page)
tPAGE
tAVQV1
CE# = VIL,
OE# = VIL
–
25
–
25
–
30
ns
tLZ
tELQX
OE# = VIL
0
–
0
–
0
–
ns
tE
tELQV
OE# = VIL
–
60
–
70
–
80
ns
tOLZ
tGLQX
CE# = VIL
0
–
0
–
0
–
ns
OE# LOW to output valid
tOE
tGLQV
CE# = VIL
–
25
–
25
–
30
ns
CE# HIGH to output High-Z
tHZ
tEHQZ
OE# = VIL
–
25
–
25
–
30
ns
2
OE# HIGH to output High-Z
tDF
tGHQZ
CE# = VIL
–
25
–
25
–
30
ns
2
CE#, OE#, or address
transition to output
transition
tOH
tEHQX,
–
0
–
0
–
0
–
ns
Address valid to next address
valid
CE# LOW to output
transition
CE# LOW to output valid
OE# LOW to output
transition
Notes
2
2
tGHQX,
tAXQX
tEHQV
CE# to BYTE# LOW
tELFL
tELBL
–
–
5
–
5
–
5
ns
CE# to BYTE# HIGH
tELFH
tELBH
–
–
5
–
5
–
5
ns
tELQZ
BYTE# LOW to output
High-Z
tFLQZ
tBLQZ
–
–
25
–
25
–
30
ns
BYTE# HIGH to output valid
tFHQV
tBHQV
–
–
30
–
30
–
30
ns
Notes:
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1. The 60ns device is available upon customer request.
2. Sampled only; not 100% tested.
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Read AC Characteristics
Figure 17: Random Read AC Timing (8-Bit Mode)
tRC
A[MAX:0]/A-1
Valid
tACC
tOH
CE#
tCE
tOH
tLZ
tHZ
OE#
tOLZ
tOH
tOE
tDF
DQ[7:0]
Valid
BYTE#
tELFL
Note:
1. BYTE# = VIL
Figure 18: Random Read AC Timing (16-Bit Mode)
tRC
A[MAX:0]
Valid
tACC
tOH
CE#
tE
tOH
tLZ
tHZ
OE#
tOLZ
tOH
tOE
tDF
DQ[14:0]
DQ15A-1
Valid
BYTE#
tELFH
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Read AC Characteristics
Figure 19: Page Read AC Timing (16-Bit Mode)
A[MAX:3]
A[2:0]
Valid
Valid
Valid
Valid
Valid
Valid
Valid
Valid
tACC
CE#
tE
tOH
tHZ
OE#
tPAGE
tOE
tOH
tDF
DQ[15:0]
DQ15A-1
Valid
Note:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
Valid
Valid
Valid
Valid
Valid
Valid
1. Page size is 8 words (16 bytes) and is addressed by address inputs A[2:0] in x16 bus mode
and A[2:0] plus DQ15/A−1 in x8 bus mode.
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Write AC Characteristics
Write AC Characteristics
Table 29: WE#-Controlled Write AC Characteristics
Symbol
Parameter
Address valid to next address
valid
60ns2
VCCQ = VCC
70ns
VCCQ = VCC
80ns
VCCQ = 1.65V
to VCC
Unit
Legacy
JEDEC
Min
Max
Min
Max
Min
Max
tWC
tAVAV
65
–
75
–
85
–
ns
CE# LOW to WE# LOW
tCS
tELWL
0
–
0
–
0
–
ns
WE# LOW to WE# HIGH
tWP
tWLWH
35
–
35
–
35
–
ns
Input valid to WE# HIGH
tDS
tDVWH
45
–
45
–
45
–
ns
WE# HIGH to input transition
tDH
tWHDX
0
–
0
–
0
–
ns
WE# HIGH to CE# HIGH
tCH
tWHEH
0
–
0
–
0
–
ns
WE# HIGH to WE# LOW
tWPH
tWHWL
30
–
30
–
30
–
ns
Address valid to WE# LOW
tAS
tAVWL
0
–
0
–
0
–
ns
WE# LOW to address transition
tAH
tWLAX
45
–
45
–
45
–
ns
OE# HIGH to WE# LOW
–
tGHWL
0
–
0
–
0
–
ns
WE# HIGH to OE# LOW
tOEH
tWHGL
0
–
0
–
0
–
ns
Program/erase valid to
RY/BY# LOW
tBUSY
tWHRL
–
30
–
30
–
30
ns
VCC HIGH to CE# LOW
tVCS
tVCHEL
50
–
50
–
50
–
µs
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
Notes
2
3
1. The 60ns device is available upon customer request.
2. The user's write timing must comply with this specification. Any violation of this write
timing specification may result in permanent damage to the NOR Flash device.
3. Sampled only; not 100% tested.
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Write AC Characteristics
Figure 20: WE#-Controlled Program AC Timing (8-Bit Mode)
3rd Cycle
4th Cycle
Data Polling
tWC
A[MAX:0]/A-1
READ Cycle
tWC
AAAh
PA
PA
tAH
tAS
tCH
tCS
tCE
CE#
tOE
tGHWL
OE#
tWPH
tWP
WE#
tWHWH1
tDS
DQ[7:0]
A0h
PD
DQ7#
tDF
DOUT
tOH
DOUT
tDH
Notes:
PDF: 09005aef84bd3b68
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1. Only the third and fourth cycles of the PROGRAM command are represented. The PROGRAM command is followed by checking of the status register data polling bit and by a
READ operation that outputs the data (DOUT) programmed by the previous PROGRAM
command.
2. PA is the address of the memory location to be programmed. PD is the data to be programmed.
3. DQ7 is the complement of the data bit being programmed to DQ7. (See Data Polling Bit
[DQ7].)
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Write AC Characteristics
Figure 21: WE#-Controlled Program AC Timing (16-Bit Mode)
3rd Cycle
4th Cycle
Data Polling
READ Cycle
tWC
tWC
A[MAX:0]
555h
PA
PA
tAS
tAH
tCH
tCS
tE
CE#
tGHWL
tOE
OE#
tWP
tWPH
WE#
tWHWH1
tDS
DQ[14:0]/A-1
AOh
PD
DQ7#
tDF
DOUT
tOH
DOUT
tDH
Notes:
PDF: 09005aef84bd3b68
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1. Only the third and fourth cycles of the PROGRAM command are represented. The PROGRAM command is followed by checking of the status register data polling bit and by a
READ operation that outputs the data (DOUT) programmed by the previous PROGRAM
command.
2. PA is the address of the memory location to be programmed. PD is the data to be programmed.
3. DQ7 is the complement of the data bit being programmed to DQ7. (See Data Polling Bit
[DQ7].)
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Write AC Characteristics
Table 30: CE#-Controlled Write AC Characteristics
Parameter
Symbol
60ns2
VCCQ = VCC
70ns
VCCQ = VCC
80ns
VCCQ = 1.65V
to VCC
Unit
Legacy
JEDEC
Min
Max
Min
Max
Min
Max
Address valid to next address
valid
tWC
tAVAV
65
–
75
–
85
–
ns
WE# LOW to CE# LOW
tWS
tWLEL
0
–
0
–
0
–
ns
CE# LOW to CE# HIGH
tCP
tELEH
35
–
35
–
35
–
ns
Input valid to CE# HIGH
tDS
tDVEH
45
–
45
–
45
–
ns
CE# HIGH to input transition
tDH
tEHDX
0
–
0
–
0
–
ns
CE# HIGH to WE# HIGH
tWH
tEHWH
0
–
0
–
0
–
ns
CE# HIGH to CE# LOW
tCPH
tEHEL
30
–
30
–
30
–
ns
Address valid to CE# LOW
tAS
tAVEL
0
–
0
–
0
–
ns
CE# LOW to address transition
tAH
tELAX
45
–
45
–
45
–
ns
–
tGHEL
0
–
0
–
0
–
ns
OE# HIGH to CE# LOW
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
Notes
2
1. The 60ns device is available upon customer request.
2. The user's write timing must comply with this specification. Any violation of this write
timing specification may result in permanent damage to the NOR Flash device.
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Write AC Characteristics
Figure 22: CE#-Controlled Program AC Timing (8-Bit Mode)
3rd Cycle
4th Cycle
Data Polling
AAAh
PA
PA
tWC
A[MAX:0]/A-1
tAS
tAH
tWH
tWS
WE#
tGHEL
OE#
tCP
tCPH
CE#
tWHWH1
tDS
DQ[7:0]
A0h
PD
DQ7#
DOUT
tDH
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
1. Only the third and fourth cycles of the PROGRAM command are represented. The PROGRAM command is followed by checking of the status register data polling bit.
2. PA is the address of the memory location to be programmed. PD is the data to be programmed.
3. DQ7 is the complement of the data bit being programmed to DQ7. (See Data Polling Bit
[DQ7].)
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Write AC Characteristics
Figure 23: CE#-Controlled Program AC Timing (16-Bit Mode)
3rd Cycle
4th Cycle
Data Polling
555h
PA
PA
tWC
A[MAX:0]
tAH
tAS
tWH
tWS
WE#
tGHEL
OE#
tCPH
tCP
CE#
tWHWH1
tDS
DQ[14:0]/A-1
AOh
PD
DQ7#
DOUT
tDH
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
1. Only the third and fourth cycles of the PROGRAM command are represented. The PROGRAM command is followed by checking of the status register data polling bit.
2. PA is the address of the memory location to be programmed. PD is the data to be programmed.
3. DQ7 is the complement of the data bit being programmed to DQ7. (See Data Polling Bit
[DQ7].)
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
69
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256Mb: 3V Embedded Parallel NOR Flash
Write AC Characteristics
Figure 24: Chip/Block Erase AC Timing (8-Bit Mode)
tWC
A[MAX:0]/
A–1
AAAh
555h
tAS
AAAh
AAAh
AAAh
BAh1
555h
tAH
tCH
tCS
CE#
tGHWL
OE#
tWP
tWPH
WE#
tDS
DQ[7:0]
AAh
55h
80h
AAh
55h
10h/
30h
tDH
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
1. For a CHIP ERASE command, the address is AAAh, and the data is 10h; for a BLOCK
ERASE command, the address is BAd, and the data is 30h.
2. BAd is the block address.
3. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Accelerated Program, Data Polling/Toggle AC Characteristics
Accelerated Program, Data Polling/Toggle AC Characteristics
Table 31: Accelerated Program and Data Polling/Data Toggle AC Characteristics
Note 1 and 2 apply to entire table
Symbol
Parameter
Legacy
JEDEC
Min
Max
Unit
–
tVHVPP
250
–
ns
Address setup time to OE# LOW during toggle bit polling
tASO
tAXGL
10
–
ns
Address hold time from OE# during toggle bit polling
tAHT
tGHAX, tEHAX
10
–
ns
CE# HIGH during toggle bit polling
tEPH
tEHEL2
10
–
ns
Output hold time during data and toggle bit polling
tOEH
tWHGL2,
20
–
ns
Program/erase valid to RY/BY# LOW
tBUSY
–
30
ns
VPP/WP# rising or falling time
tGHGL2
Notes:
tWHRL
1. Specifications apply to 60, 70, and 80ns devices unless otherwise noted. The 60ns device
is available upon customer request.
2. Sampled only; not 100% tested.
Figure 25: Accelerated Program AC Timing
VPP/WP#
VPPH
VIL or VIH
tVHVPP
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
71
tVHVPP
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Accelerated Program, Data Polling/Toggle AC Characteristics
Figure 26: Data Polling AC Timing
tCE
tCH
tHZ/tDF
CE#
tOPH
tOE
OE#
tOEH
WE#
DQ7
Data
DQ7#
DQ7#
Valid DQ7
Data
DQ[6:0]
Data
Output flag
Output flag
Valid
DQ[6:0] Data
tBUSY
RY/BY#
Notes:
1. DQ7 returns a valid data bit when the PROGRAM or ERASE command has completed.
2. See the following tables for timing details: Read AC Characteristics, Accelerated Program and Data Polling/Data Toggle AC Characteristics.
Figure 27: Toggle/Alternative Toggle Bit Polling AC Timing (8-Bit Mode)
A[MAX:0]/
A–1
tAHT
tASO
CE#
tOEH
tASO
tAHT
WE#
tOPH
tEPH
tOPH
OE#
tDH
DQ6/DQ2
tCE
tOE
Data
Toggle
Toggle
Toggle
Stop
toggling
Output
Valid
tBUSY
RY/BY#
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
1. DQ6 stops toggling when the PROGRAM or ERASE command has completed. DQ2 stops
toggling when the CHIP ERASE or BLOCK ERASE command has completed.
2. See the following tables for timing details: Read AC Characteristics, Accelerated Program and Data Polling/Data Toggle AC Characteristics.
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Program/Erase Characteristics
Program/Erase Characteristics
Table 32: Program/Erase Characteristics
Notes 1 and 2 apply to entire table
Parameter
Min
Typ
Max
Unit
Notes
–
145
–
125
400
s
3, 4
400
s
4
Block erase (128KB)
–
0.5
2
s
4, 5
Erase suspend latency time
–
25
45
µs
50
–
–
µs
–
1
–
ms
6
–
16
200
µs
4
VPP/WP# =
VPPH
–
50
200
µs
4
VPP/WP# =
VIH
–
70
200
µs
4
–
16
200
µs
4
VPP/WP# =
VPPH
–
50
200
µs
4
VPP/WP# =
VIH
–
70
200
µs
4
Chip erase
Chip erase
VPP/WP# =
VPPH
Block erase timeout
Erase to suspend
Byte program
Single-byte program
Write to buffer program
(64 bytes at a time)
Word program
Single-word program
Write to buffer program
(32 words at a time)
Chip program (byte by byte)
–
540
800
s
4
Chip program (word by word)
–
270
400
s
4
Chip program (write to buffer program)
–
25
200
s
4, 7
Chip program (write to buffer program with VPP/WP# = VPPH)
–
13
50
s
4, 7
Chip program (enhanced buffered program)
–
15
60
s
7
Chip program (enhanced buffered program with VPP/WP# = VPPH)
–
10
40
s
7
Program suspend latency time
–
5
15
µs
100,000
–
–
cycles
20
–
–
years
PROGRAM/ERASE cycles (per block)
Data retention
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
1. Typical values are measured at room temperature and nominal voltages and are not for
cycled devices.
2. Typical and maximum values are sampled, but not 100% tested.
3. Time needed to program the whole array at 0 is included.
4. Maximum value measured at worst case conditions for both temperature and VCC after
100,000 PROGRAM/ERASE cycles.
5. Block erase polling cycle time. (See the Data Polling AC Waveforms figure.)
6. Erase to suspend is the typical time between an initial BLOCK ERASE or ERASE RESUME
command and a subsequent ERASE SUSPEND command. Violating the specification repeatedly during any particular block erase may cause erase failures.
7. Intrinsic program timing means without the time required to execute the bus cycles to
load the PROGRAM commands.
73
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Package Dimensions
Package Dimensions
Figure 28: 56-Pin TSOP – 14mm x 20mm
1.1 ±0.1
Pin A1 ID
1
56
0.5 TYP
56X 0.22 ±0.05
28
14 ±0.1
29
18.4 ±0.1
56X 0.1 ±0.05
20 ±0.2
Plating material composition: Ni/Pd/Au.
Plastic package material: epoxy novolac.
Package width and length include mold flash.
0.1 A
0.15 ±0.05
See Detail A
0.25 gage plane
Seating plane
(0.1 ±0.05)
A
0.6 ±0.1
Detail A
Notes:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
1. All dimensions are in millimeters.
2. For the lead width value of 0.22 ±0.05, there is also a legacy value of 0.15 ±0.05.
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Package Dimensions
Figure 29: 64-Ball TBGA – 10mm x 13mm
10.00 ±0.10
1.50 TYP
7.00 TYP
3.00 TYP
0.50 TYP
7.00 TYP
0.50 TYP
13.00 ±0.10
0.10 MAX
BALL "A1"
1.00 TYP
0.35 MIN/
0.50 MAX
0.30 -0.10
+0.05
1.20 MAX
Note:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
0.80 TYP
1. All dimensions are in millimeters.
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256Mb: 3V Embedded Parallel NOR Flash
Package Dimensions
Figure 30: 64-Ball Fortified BGA – 11mm x 13mm
0.80 TYP
Seating
plane
0.10
64X
Ball A1 ID
8
7
6
5
4
3 2
1
3.00
TYP
A
B
C
13.00 ±0.10
D
7.00 TYP
E
F
G
H
1.00
TYP
1.00
TYP
0.60 ±0.05
2.00 TYP
1.40 MAX
0.48 ±0.05
7.00 TYP
11.00 ±0.10
Note:
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
1. All dimensions are in millimeters.
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256Mb: 3V Embedded Parallel NOR Flash
Revision History
Revision History
Rev. F – 2/18
• Added Important Notes and Warnings section for further clarification aligning to industry standards
Rev. E – 7/16
• Corrected Device ID
Rev. D – 5/15
• Updated TSOP package
Rev. C – 7/13
• Minor text edits
• Added Erase to suspend specifications to Program/Erase Characteristics
Rev. B – 5/13
• Synchronized TBGA (ZA) package dimensions in the order information table with dimensions in the package diagram
Rev. A – 5/12
• Initial Micron brand release
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
PDF: 09005aef84bd3b68
m29w_256mb.pdf - Rev. F 2/18 EN
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